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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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2019 IPC APEX EXPO Call for Posters
December 11, 2018 | IPCEstimated reading time: Less than a minute
Gain significant visibility for you and your company on your research and knowledge by creating a technical poster at one of the industry's premier conferences on electronics manufacturing. Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is seen by key engineers, managers and executives from all segments of the electronic interconnect industry worldwide. Posters will be displayed throughout the event. Poster presentations are scheduled for Wednesday, January 30, 2019 offering additional visibility.
Poster Topics
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes and equipment.
Requirements for Submission
Provide an abstract of up to 300 words that summarizes technical and previously unpublished work covering case histories, research and discoveries.
Poster Presenter Benefits
Poster presenters are entitled to a free One-Day Conference Pass for Wednesday, January 30, 2019.
Deadline for Abstracts: Monday, December 17, 2018
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