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Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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2019 IPC APEX EXPO Call for Posters
December 11, 2018 | IPCEstimated reading time: Less than a minute
Gain significant visibility for you and your company on your research and knowledge by creating a technical poster at one of the industry's premier conferences on electronics manufacturing. Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is seen by key engineers, managers and executives from all segments of the electronic interconnect industry worldwide. Posters will be displayed throughout the event. Poster presentations are scheduled for Wednesday, January 30, 2019 offering additional visibility.
Poster Topics
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes and equipment.
Requirements for Submission
Provide an abstract of up to 300 words that summarizes technical and previously unpublished work covering case histories, research and discoveries.
Poster Presenter Benefits
Poster presenters are entitled to a free One-Day Conference Pass for Wednesday, January 30, 2019.
Deadline for Abstracts: Monday, December 17, 2018
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Horizon Sales Celebrates 10 Years of Exceptional Service by Sales Leader David Smith
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Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
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