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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Mentor Webinar on Best Practice Design Processes
December 13, 2018 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Increasing performance requirements coupled with a pressure to improve product quality are driving engineering teams to consider alternatives to their current validation approach. Best-practice design processes validate a digital twin model of your design early and often to minimize re-spins and actually shorten the overall design cycle.
This 'left shift' approach enables design engineers and layout designers to validate within their native environment, minimizing the bottleneck waiting for specialist reviews, and freeing the specialists to resolve the remaining critical issues.
This session will look at new, integrated technologies for analysis and verification deployed throughout the design process, including: schematic verification, signal & power integrity, electrical sign-off, thermal, vibration, testability and manufacturability.
This webinar is presented by David Wiens, product manager of the Systems Design Division of Mentor Graphics, a Siemens business.
To view this webinar, click here.
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Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
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IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.