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EMS Installs Second MEK AOI Machine
December 18, 2018 | Electronic Manufacturing Solutions Ltd (EMS)Estimated reading time: 1 minute
Electronic Manufacturing Solutions Limited (EMS) has installed a new MEK PowerSpector GTAz+GDAz 550BTL CE 9 Camera inline AOI machine.
The PowerSpector GTAz+GDAz 550BTL contains one off 18.75u HD Camera with telecentric optics and eight off 10u side cameras for side and edge inspection of components. The omnidirectional multi angle, multi-colour LED lighting provides class leading assessment of the solder meniscus and the capability to test a range of criteria on all types of solder joints.
“I am very pleased with the investment in our PowerSpector GTAz+GDAz 550BTL, the additional capacity it brings along with its class leading optics. This is another significant step in the company’s growth”, said Bernard Chubb, managing director of EMS.
This will enable us to increase capacity dramatically, we look forward to being able to provide increased customer satisfaction through this additional resource whilst continuing with industry-leading turnaround times and exceptional levels of quality,” said EMS’ Sales Manager Rob Moore.
“The PowerSpector GTAz+GDAz 550BTL is a critical investment in keeping pace with the increasing miniaturisation and complexity with the class leading optics, software and support being critical to the EMS selecting MEK.”, said Jonathan Plummer, General Manager of EMS. “The MEK PowerSpector GTAz+GDAz 550BTL contains two camera, top and bottom, which are able to inspect both sides of an assembly in one process, be it double sided surface mount only or surface mount and through hole”.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.