-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SMS Selects Metcal CV-500 System
December 19, 2018 | MetcalEstimated reading time: 2 minutes
SMS – Smart Made Simple’s strategic capital equipment partner Metcal, have selected them as the first company in the UK to trial the new Metcal CV-500 system, the latest addition to their Connection Validation family of products.
“Strong working relationships are critical to our business development and SMS – Smart Made Simple has proven to be an invaluable source of feedback and inspiration to Metcal for many years. We share the same drive and ambition. Constantly pushing boundaries, improving technology in cutting-edge design, process control, and high-quality high-reliability manufacture. We are excited to place our new system into their nurturing hands,” said Neil Edwards, Metcal regional sales manager.
So, what can SMS – Smart Made Simple expect the new Metcal CV 500 system to do for their operations?
The new Metcal CV-500 Connection Validation soldering system offers process control via a visual indication to the operator that a solder joint has been formed with a satisfactory Intermetallic Compound layer (IMC) in real time. This technology, Connection Validation, provides a mechanism of ensuring consistent joint integrity by ensuring the hand soldering process delivers an IMC layer between 1.0µm and 4.0µm (SAC305).
The Connection Validation algorithm is a Metcal propriety Technology and utilises static characteristic of the solder tip, Idle Power, and tip thermal efficiency descriptors to characterise energy delivery in the soldering process using polynomial interpolation and curve fitting techniques to determine the IMC formation as a function of the power signature for the thermal energy demand of the process
The system also provides the operator with a visual indication of the Tip’s idle temperature, Tip Part number, Tip Serial Number and Lot number to ensure the correct tip cartridge is selected and process traceability is achieved. Metcal Tip cartridge temperature is fixed and controlled inherently by the curie point of the material in the heater with Metcal’s proprietary “Smart Heat” technology and therefore does not require calibration
A first for the industry the new CV-500 Soldering system also captures Hand soldering Data for accurate process control and Data analysis. Improve your solder process traceability and create a performance baseline using CV's intelligent cartridges plus CV-500 Monitor software. Using our Connection Validation patented technology, CV Monitor software allows you to capture solder process information over time for each joint when attached to the systems communication port. Now that you have a baseline, you can quickly analyse your soldering performance, identify changes in your solder conditions, and make changes to your process
“Metcal and SMS have shared a common vision based on many years of expertise and industry experience, it’s Smart Made Simple to collaborate in this way and bring their product to life within our real-world electronics manufacturing environment. We are looking forward to the driving results, efficiency, and yield,” Graham Shaw, chief operations officer, SMS – Smart Made Simple concluded.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.