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Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

KYZEN to Highlight Understencil Cleaning Solutions at SMTA Querétaro Expo and Tech Forum

07/07/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 16, at Centro de Congresos y Teatro Metropolitano de Querétaro.

Learning With Leo: Soldering—The Interpretation Problem

06/30/2026 | Leo Lambert -- Column: Learning With Leo
At EPTAC, we operate the largest electronics training facility in the United States, and that gives us a vantage point few others have. I’ve spent most of my career on the training floor and in the rooms where IPC standards get written and revised. Every week, engineers, operators, inspectors, and quality teams come to us from across the country and across industries for help, and they bring their toughest questions. On the surface, they’re asking about toe fillets, gold plating, or rework limits. But underneath those questions is something more important: uncertainty about reliability.

Fresh PCB Concepts: Engineering Copper Coin and Copper Pedestal Technology With IPC Design Interpretation

06/25/2026 | Team NCAB -- Column: Fresh PCB Concepts
Copper coin and copper pedestal technologies have become increasingly important in modern PCB design as thermal demands rise in power electronics, automotive systems, RF applications, aerospace electronics, and high-density computing environments. As component power density increases and board sizes shrink, traditional thermal management techniques often become insufficient to maintain acceptable operating temperatures and long-term reliability.

Altus Group Expands Soldering Portfolio with SEHO Partnership

06/22/2026 | Altus Group
Altus Group, a leading distributor of capital equipment for electronics manufacturing in the UK and Ireland, has announced a new partnership with SEHO Systems GmbH, a German manufacturer specialising in wave and selective soldering systems, automation technology as well as THT inspection solutions.
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