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Top 10 Most-Read MilAero News
December 26, 2018 | I-Connect007Estimated reading time: 2 minutes

1. Elbit Systems Wins $17M Electronic Warfare Contract
Elbit Systems Ltd. announced today that it was awarded an approximately $17 million contract from a European country to supply a range of advanced ground-based Electronic Warfare (EW) and Signal Intelligence (SIGINT) systems. The contract will be performed over a two-year period.
2. PDR Joins Forces with USM Reps in Mexico
PDR has partnered with USM Reps its manufacturers’ representative. Eduardo Ortiz will represent PDR’s IR rework systems throughout Mexico (excluding Baja), the Central America region and El Paso, Texas.
Lockheed Martin and Cobham are joining forces for the Next Generation Jammer Low Band (NGJ-LB) competition to replace the U.S. Navy's ALQ-99 tactical jamming system currently on the E/A-18 Growler aircraft.
4. IPC Volunteers Honored for their Contributions to Industry at IPC APEX EXPO 2018
IPC – Association Connecting Electronics Industries presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO 2018 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
5. Moving Compass Call Electronic Warfare System to Modern Business Jet
BAE Systems has begun work to transition its advanced Compass Call electronic warfare (EW) system from aging EC-130H aircraft to a modern, more capable platform that will significantly improve mission effectiveness.
6. Elbit Systems Wins $85 Million Contract to Supply Electronic Warfare Systems
Elbit Systems Ltd. announced today that it was awarded an approximately $85 million contract from a European country to supply a range of advanced ground-based electronic warfare (EW) and signal intelligence (SIGINT) systems. The contract will be performed over a four-year period.
7. I-Connect007 Launches Thermal Management with Insulated Metal Substrates eBook
I-Connect007 is excited to announce the release of the latest title in our micro eBook design series: The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates.
8. Global Electronic Warfare Market to See CAGR of 6.2% from 2017-2026
The Global Electronic Warfare market is accounted for $22.19 billion in 2017 and is expected to reach $38.31 billion by 2026 growing at a CAGR of 6.2%.
9. I-Connect007 Launches Fundamentals of RF/Microwave PCBs Micro eBook
I-Connect007 is excited to announce the release of the latest title in our micro eBook design series: The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs.
10. Benefits of Low-Temp Soldering: I-007eBook Now Available
Tired of solder joint failures? Get your head off the pillow! Learn about opportunities and solutions provided by low-temperature soldering in I-Connect007’s newest micro eBook: The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.