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Top 10 Most-Read SMT Interviews of 2018
January 4, 2019 | Stephen Las Marias, I-Connect007Estimated reading time: 2 minutes

We continue our top 10 lists, this time with the most-read SMT interviews in 2018. Topping the list is an interview with Joe O’Neil and Matthew Becker of Power Design Services (PDS), and Ted Park of Green Circuits, who announced their merger last year. Read on.
Combining Strengths Synergistically: PDS and Green Circuits
Power Design Services (PDS) and Green Circuits have just announced their merger. I-Connect007 Publisher Barry Matties sat down with Joe O’Neil and Matthew Becker of PDS, along with Ted Park of Green Circuits, to get the full scoop.
Super Dry’s Novel Approach to the Drying Process
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.
Interview with Dave Hillman: IPC’s 2018 Raymond E. Pritchard Hall of Fame Award Winner
A self-described "dinosaur" of the industry, Dave Hillman has been a steady force in all things solder-related at Rockwell Collins for 30 years. And just to keep things fresh, he has spent years mentoring both college-age and younger children. In this interview, I-Connect007’s Patty Goldman gives Hillman a chance to tell his story.
The Direction of Autonomous Driving
Flex (formerly Flextronics) is a company that I've worked with for decades, both as a customer and as a supplier. Recently, they were honored with Frost & Sullivan’s Manufacturing Leadership Award. I-Connect007's Dan Feinberg met with Eric Hoarau, the senior director managing automotive innovation at Flex, to discuss his company’s views on where autonomous driving technology is heading in the next 10 – 15 years.
A Not So Surprising Focus for Flex in the XR Realm
Dan Feinberg has been covering augmented, virtual, and mixed-reality for I-Connect007 for the last few years. He recently met with Eric Braddom, VP of Extended Reality (XR) Product Management for Flex, a company that is involved in this disruptive technology. In this interview, Dan and Eric discuss the future of augmented, mixed and/or virtual reality, or as Flex calls it, "extended reality."
Paco Solis, lead investigator at Foresite Inc., speaks with I-Connect007 about why cleaning is more important now, the common pitfalls and misconceptions in cleaning, and strategies to consider to ensure reliable PCB assemblies.
Indium's Karthik Vijay Talks Engineering for Automotive Applications
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.
Tempo Automation: Setting the Pace for Low-Volume, Quick-Turn Assembly
Jesse Koenig, co-founder and VP of technology at PCB assembly company Tempo Automation, discusses with I-Connect007's Patty Goldman how they are making electronics development much easier and more seamless for customers.
Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.
The Evolution of Camtek Manufacturing
Chris Davis, president and founder of EMS firm Camtek Manufacturing, in Bloomington, Illinois, discusses with Dan Beaulieu what led her to not only start Camtek from the ground up, but also what it means for her business to be a certified women's business enterprise (WBE).
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.