SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
SN100C Celebrates 20 Years of Reliable Service at IPC APEX EXPO 2019
January 3, 2019 | SN100CEstimated reading time: 1 minute
Nihon Superior Co. Ltd., an advanced joining material supplier, plans to exhibit in booth no. 1334 at the 2019 IPC APEX EXPO, scheduled to take place January 29 - 31, 2019 at the San Diego Convention Center in California. The company will celebrate the achievements produced by the well-known SN100C lead-free alloy. SN100C (032) flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
SN100C has been widely accepted as a leading lead-free soldering alloy since it was invented by Nihon Superior’s President Tetsuro Nishimura. The silver-free SN100C alloy delivers a stable microstructure in an alloy that can accommodate the long-term cyclic strains and impact loading to which a solder joint can be subjected. The micro-addition of nickel enhances the performance of SnCu, resulting in smooth and bright fillets with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, ensuring highly reliable solder joints.
The newly developed (032) is a general purpose, no-clean, halogen-free cored-flux. When paired with the SN100C lead-free alloy, it provides fast wetting and excellent solder joints, not only on copper (Cu) but also nickel (Ni) substrates. SN100C (032) is a good match for continuous robotic soldering due to the fast wetting and low spattering.
(032) cored-flux is available with the company’s new SN100CVTM lead-free alloy that gains its strength from solute atoms in the tin matrix as well as SAC305 solder.
SN100CVTM P608 D4 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The paste provides excellent wetting and reduces voiding.
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new solder pastes and lead-free products, visit us in booth #1334 at the IPC APEX EXPO 2019.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.