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January 2019 Issue of SMT007 Magazine Available Now
January 4, 2019 | I-Connect007Estimated reading time: Less than a minute

Component supplies, prices, and lead times are in a great deal of turmoil. And there are a LOT of moving parts to this set of circumstances, ranging from a sustained increase in demand for parts, to pricing pressures on manufacturers and premature parts obsolescence. All of these factors wreak havoc on electronics manufacturing.
In this month's issue of SMT007 Magazine, we explore the drivers and the coping mechanisms from all points of the supply chain.
Read the January 2019 issue of SMT007 Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.
Be sure to download the PDF version for future reference.
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NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Critical Minerals: The New Power Play in Global Trade
10/13/2025 | Marcy LaRont, I-Connect007Access to critical minerals essential for electronics manufacturing, and China’s monopoly of them, is increasingly under scrutiny, with gallium (Ga) and germanium (Ge)at the forefront of this discourse. However, all critical minerals imported from China share a similar narrative, and understanding the implications of this dependency and the risks to both U.S. commercial and defense sectors has created an urgent need for a comprehensive electronics strategy to secure and diversify access to these vital minerals. In this candid interview, USPAE Executive Director Jim Will discusses the issues and the mitigation steps that must be taken to adequately address them.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Cyient DLM, A Voice from the Frontlines
09/24/2025 | Arpita Das, Global Electronics AssociationOnce seen as a low-cost, build-to-print destination, India’s EMS sector is rapidly emerging as a global hub for high-reliability electronics, particularly in strategic sectors like aerospace, defense, and medical. As such, we highlight some companies that exemplify the strength and potential of Indian manufacturing.
Inside Thailand’s Rising PCB Hub: Touring a Chinese Fab
09/23/2025 | Edy Yu, Editor-in-Chief, ECIOFrom industry giants to emerging forces, many electronics companies are painting a grand blueprint for the future, laying out their plans in the investment hotbed of Thailand. This was evident during THECA in Thailand, where the most frequently heard buzzwords on and off the show floor were "going global," "building factories in Thailand," and "supply chain security.” With these insights, and full of expectations and questions collected at the exhibition, my team visited First Quality Circuit Co., Ltd., a subsidiary of Sihui Fuji, located in the Amata Industrial Park in Rayong, Thailand