Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Hanwha Techwin Rolls Out New Wave in Robotics at IPC APEX EXPO 2019
January 7, 2019 | Hanwha TechwinEstimated reading time: 1 minute
Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, today announced plans to exhibit in booth #1843 at the IPC APEX EXPO 2019, scheduled to take place January 29-31, 2019 at the San Diego Convention Center. The company will demonstrate the new HCR-5 Cobot and HM520 Cutting-Edge Modular Mounter.
HCR-5 represents a new wave in robotics, where Cobots can work side-by-side with humans and make the workplace safer, and start a revolution for a collaborative future together. The HCR-5, Hanwha's collaborative robot, or Cobot, autonomously handles all sorts of tedious tasks.
The HCR-5 can be taught new things to work more efficiently with you through its learning capabilities. This is the first Cobot ever to be built in Singapore to supply South East Asian manufacturers.
With the HM520 Modular Mounter, actual productivity is highest among machines of the same class and is optimized to high quality production. The system configures a flexible production line by applying a modular head and various production modes. The HM520 realizes unmanned, non-stop, and zero-defect production using the Smart Factory S/W Solution.
The high performance HM520 offers a compact foot print, auto-calibrating maintenance free feeders, and modular heads. The HS (High Speed) Head offers a 20 Spindle x 2 Gantry, 80,000 CPH, ±25 μm @ Cpk ≥ 1.0, 0201 ~ 6 mm (H 2 mm). The MF (Multi-Function) Head features a 6 Spindle x 2 Gantry, 60,000 CPH, ±30 μm @ Cpk ≥ 1.0, 0402 ~ 55 mm (H 15 mm).
Additionally, the company will showcase the US2000XF with auto-changeover capacity of 10-products, auto underboard support, paperless cleaning and closed print head. T-Solution’s for intelligent monitoring, management and execution of processes associated with SMART machinery, lines and factories performing PCB assembly, also will be on display.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.