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EVS International to Exhibit at IPC APEX EXPO 2019
January 7, 2019 | EVS InternationalEstimated reading time: Less than a minute
EVS International will showcase the EVS 8KLFHS in the Sono-Tek booth #2833 at the IPC APEX EXPO 2019, scheduled to take place January 29-31, 2019 at the San Diego Convention Center. The system features an integrated hopper that makes rapid transfer of dross simpler and safer, and speeds de-drossing times by up to 75%.
The EVS 8KLFHS offers a capacity of 6kg/12lbs. This system provides a cleaner wave with less maintenance, less downtime and a reduction in shorts and bridging, as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders.
All EVS new and fully refurbished equipment offers:
- Rapid ROI (months not years)
- Improvements for your wave solder process
- ISO14001 gain or retain (RECYCLE-REDUCE-REUSE)
- Productivity improvements (Save MONEY and TIME)
- Reduction of costs (Solder-Rework-Nitrogen-Labor-Time)
- Different sized EVS machines for different applications
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.