Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
VJ Electronix Summit LXi Expands Board Rework Capability
January 9, 2019 | VJ Electronix, Inc.Estimated reading time: 1 minute
VJ Electronix, Inc. has announced an increase in compatible board size for the Summit LXi Rework System.
Demand for extra-large boards associated with high-end applications such as cloud computing and 5G communication continues to grow. The dimensions of many complex SMT assemblies may now exceed one meter. These large boards have created new challenges for the complete range of equipment used in production, test and rework.
VJE has responded with new enhanced options for its Summit LXi large board rework system. The LXi is now available with an optional 650 mm x 1200 mm board support table. The large table may be coupled with increased bottom heater capacity of 10 kW and a local bottom spot heater up to 100 mm x 100 mm. To further speed up the rework process and maintain critical CPI, the LXi may incorporate controls for external active cooling and/or integrated cooling fans as part of the board support table.
“The Summit LXi has been the leading platform for large board rework for many years,” explains Senior Systems Engineer, Ernie LaFleur. “The system was designed from the ground up for large boards. It has the structural integrity and heating capacity to meet the process requirements for the largest boards we have seen while maintaining the accuracy and reliability our customers expect.”
The Summit LXi system is built in VJE’s Chelmsford, MA factory and is in service at many production and repair facilities around the world.
Share on:
Suggested Items
Molex Releases New Report on Strategies for Advancing Rugged, Reliable Connectivity in Modern Aerospace and Defense Applications
04/01/2025 | MolexMolex, a global electronics leader and connectivity innovator, has released a new report from AirBorn, a Molex company, which explores the unrelenting demands for constant, continuous connectivity to support the rigors of modern aerospace, defense and space-industry applications.
Yamaha Reveals Latest Updates Boosting Ease of Use in 1 STOP SMART SOLUTION
04/01/2025 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection.
Airbus to Design and Build ESA’s ExoMars Rover Lander Platform
03/31/2025 | AirbusAirbus has been selected by the European Space Agency (ESA) and Thales Alenia Space (TAS - a joint venture between Thales (67%) and Leonardo (33%)), the ExoMars industrial prime contractor, to build key systems for the ExoMars lander that will safely place the Rosalind Franklin rover on the surface of the Red Planet.
New Cryostatic Systems Elevate Current Research on Qubits
03/31/2025 | Fraunhofer IAFThe Center Nanoelectronic Technologies (CNT) at Fraunhofer IPMS has recently acquired new cryostats for the research on qubits and the qualification of superconducting systems.
The Knowledge Base: At the Forefront of Electronics Manufacturing
03/26/2025 | Mike Konrad -- Column: The Knowledge BaseThe electronics manufacturing industry is at a transformative crossroads, shaped by emerging technologies, shifting supply chain dynamics, sustainability initiatives, and the relentless push for miniaturization and efficiency. The industry's future will be defined by innovations in semiconductor manufacturing, automation, artificial intelligence (AI), and sustainable practices. Here, I will explore the key developments that are propelling the industry forward and their implications for manufacturers, engineers, and stakeholders.