Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
FKN Systek Launches Multiple Blade PCB Depaneling Saw
January 10, 2019 | FKN SystekEstimated reading time: 1 minute
For boards with tall components closely spaced or with sensitive SMT components near the parting line. Now available from FKN Systek, the S300 multiple blade depaneling saw for use in singulating assembled PCBs. The saw blade is a 2.95" (75mm) diameter .021" thick diamond coated cutting blade. The S300 is a PLC controlled machine which can singulate up to 10 lines in one pass. The operator places the board to be cut onto the tooling plate and a hold down cover is placed on top of the panel. Closing the safety cover enables the process where the operator activates the start switch. This will cause the microprocessor to start the saw motor, and after a short delay bring the support plate and PCB past the blade arbor for singulation of the panels. A safety switch built into the lid will automatically stop the saw if the lid is opened during the process.
A dust extraction plenum is integrated into the saw for dust removal during the process. A separate dust removal wand for board clean up is mounted to the side of the machine. Built to provide a stress free method to singulate panels with sensitive surface mount components close to the edge of the parting section, the diamond blades on the FKN Systek depaneling saw leave a smooth edge finish with minimal stress imparted to the PCB. The saws can also be used to singulate PCBs without scorelines, or to singulate PCBs with overhanging components on the parting line. Since the cutting depth can be set to just cut through the PCB itself, any components which overhang the parting line will remain intact.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
PCBA Market Poised to Reach $147.5 Billion by 2035
10/20/2025 | Globe NewswireGlobal printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Sumitomo Riko Boosts Automotive Design Efficiency 10x with Ansys AI Simulation Technology
10/13/2025 | SynopsysSumitomo Riko is implementing Ansys, part of Synopsys, Inc. AI technology to accelerate time-to-solution and improve efficiency during the design and manufacturing of automotive components.