Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
FKN Systek Launches Multiple Blade PCB Depaneling Saw
January 10, 2019 | FKN SystekEstimated reading time: 1 minute
For boards with tall components closely spaced or with sensitive SMT components near the parting line. Now available from FKN Systek, the S300 multiple blade depaneling saw for use in singulating assembled PCBs. The saw blade is a 2.95" (75mm) diameter .021" thick diamond coated cutting blade. The S300 is a PLC controlled machine which can singulate up to 10 lines in one pass. The operator places the board to be cut onto the tooling plate and a hold down cover is placed on top of the panel. Closing the safety cover enables the process where the operator activates the start switch. This will cause the microprocessor to start the saw motor, and after a short delay bring the support plate and PCB past the blade arbor for singulation of the panels. A safety switch built into the lid will automatically stop the saw if the lid is opened during the process.
A dust extraction plenum is integrated into the saw for dust removal during the process. A separate dust removal wand for board clean up is mounted to the side of the machine. Built to provide a stress free method to singulate panels with sensitive surface mount components close to the edge of the parting section, the diamond blades on the FKN Systek depaneling saw leave a smooth edge finish with minimal stress imparted to the PCB. The saws can also be used to singulate PCBs without scorelines, or to singulate PCBs with overhanging components on the parting line. Since the cutting depth can be set to just cut through the PCB itself, any components which overhang the parting line will remain intact.
Share on:
Suggested Items
Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
Nano Dimension Unveils 3D Printer for Micro Applications at Formnext
11/19/2024 | Nano DimensionNano Dimension, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announces the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications. Developed to enable the creation of superior resolution micro parts at high production throughput, the high-speed Exa was unveiled today for the first time globally at Formnext in Frankfurt, Germany (Hall 11, Stand D22).
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
ZenaTech Participates in Taiwan Trade Mission to Open First Asian Office for ZenaDrone AI Drone Sensor and Component Manufacturing
11/07/2024 | NEWMEDIAWIREZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drone solutions and enterprise SaaS (Software-as-a-Service) solutions, announces that company principals are currently participating in a Trade Mission to Taipei, Taiwan as part of an Arizona Commerce Authority (ACA) delegation, with the goal of opening a manufacturing office for its previously announced Spider Vision Sensors Ltd. subsidiary.