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FKN Systek Launches Multiple Blade PCB Depaneling Saw
January 10, 2019 | FKN SystekEstimated reading time: 1 minute
For boards with tall components closely spaced or with sensitive SMT components near the parting line. Now available from FKN Systek, the S300 multiple blade depaneling saw for use in singulating assembled PCBs. The saw blade is a 2.95" (75mm) diameter .021" thick diamond coated cutting blade. The S300 is a PLC controlled machine which can singulate up to 10 lines in one pass. The operator places the board to be cut onto the tooling plate and a hold down cover is placed on top of the panel. Closing the safety cover enables the process where the operator activates the start switch. This will cause the microprocessor to start the saw motor, and after a short delay bring the support plate and PCB past the blade arbor for singulation of the panels. A safety switch built into the lid will automatically stop the saw if the lid is opened during the process.
A dust extraction plenum is integrated into the saw for dust removal during the process. A separate dust removal wand for board clean up is mounted to the side of the machine. Built to provide a stress free method to singulate panels with sensitive surface mount components close to the edge of the parting section, the diamond blades on the FKN Systek depaneling saw leave a smooth edge finish with minimal stress imparted to the PCB. The saws can also be used to singulate PCBs without scorelines, or to singulate PCBs with overhanging components on the parting line. Since the cutting depth can be set to just cut through the PCB itself, any components which overhang the parting line will remain intact.
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