-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson SELECT Integra 508.3 to Make its North American Debut at IPC APEX EXPO 2019
January 10, 2019 | Nordson SELECTEstimated reading time: 2 minutes

Nordson SELECT, a Nordson company, has announced that its Integra 508.3 will make its North American debut at the 2019 IPC APEX Expo, scheduled to take place January 29-30, 2019 at the San Diego Convention Center in San Diego, California.
The Integra 508.3 is a multi-station selective soldering system designed for high-volume applications with maximum throughput. With its flexible configuration, the Integra 508.3 is a versatile selective soldering platform and can be equipped for either single, parallel or double processing. When configured with dual drop-jet fluxers and dual solder pots, the Integra 508.3 can solder two boards at the same time in each soldering station. When operated in the parallel mode, the Integra 508.3 can process up to six boards at one time significantly increasing machine productivity.
Also featured will be a range of selective soldering systems for various applications, including the award-winning Integra 103ILD, the versatile Cerno 103IL, and the compact Novo 300.
The Integra 103ILD is a dual pot selective soldering system and features Nordson SELECT’s unique automatic solder nozzle tinning system. Unlike other nozzle cleaning systems, Nordson SELECT’s patent pending system does not spray an adipic acid, or a liquid or powdered flux. This exceptional solder nozzle tinning system keeps the solder nozzles prestigiously clean by automatically removing oxidation residues and re-tinning the surface of the solder nozzles without any resulting overspray or contamination of the printed circuit board or the selective soldering machine.
Nordson SELECT’s Cerno 103IL is a fully-configured SMEMA compatible selective soldering system equipped with standard features including interchangeable solder pots and pumps compatible with tin-lead, lead-free and HMP solder alloys. The Cerno 103IL comes standard with an automated fiducial location and correction system that provides single click fiducial teach capability, seamless fiducial recognition and true automated alignment and skew correction of a printed circuit board. The system also features board mapping and pattern recognition of a correct board assembly, x-out circuits or missing components.
Also on display will be the Novo 300, an entry lvel selective soldering platform with a compact footprint requiring less than 1.1 square meters of factory floor space. The Novo® 300 is a standalone platform that is ideally suited for prototype, cell manufacturing or small batch production.
About Nordson SELECT
Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo standalone machines offering exceptional value and superior process capability ideal for batch production, Cerno in-line systems delivering uncompromised quality and productivity for demanding soldering applications, and Integra multi-station modular systems designed to meet the most challenging high-volume requirements by combining parallel processing with multiple soldering nozzles for the ultimate in flexibility and maximum throughput.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.