Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.

AI Drives High-End IC Substrate Growth to US$19.51B in 2026

09/10/2026 | TPCA
As demand for generative AI, high-performance computing (HPC), and data center infrastructure continues to accelerate, the global IC substrate industry is entering a new phase characterized by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.

Rocket Lab Introduces High-Efficiency Solar Cell

09/10/2026 | Globe Newswire
Rocket Lab Corporation, a global leader in launch services and space systems, announced the production release of Inverted Metamorphic (IMM) Apex, the latest iteration of its next-generation solar cell designed to deliver exceptional efficiency and reliability for space applications.

Silicon Labs Opens New Austin Innovation Center with Support from Texas CHIPS Act

09/09/2026 | Silicon Labs
Silicon Labs, the leader in low-power wireless connectivity, celebrated the opening of its new research and development (R&D) laboratory for advanced chip design and testing in Austin.

HyperLight Welcomes VentureTech Alliance to Series C

09/09/2026 | BUSINESS WIRE
HyperLight Corporation, a leader in thin-film lithium niobate (TFLN) photonics, announced that VentureTech Alliance (VTA) has joined its Series C financing round.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in