Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Dr. Jennie Hwang to Hold Course on Preventing Defects and Failures at IPC APEX EXPO 2019
January 11, 2019 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: 1 minute
Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments in packaging and assembly and with the goal of achieving high yield and reliability in mind, the “how-to” prevent prevailing production defects and product reliability issues through an understanding of potential causes is a necessity.
At the upcoming IPC APEX EXPO 2019 in San Diego, California, Dr. Jennie Hwang will hold a professional development course that will address two selected areas related to product failure—intermetallics and tin whisker—and the top five production defects: PCB pad cratering vs. pad lifting, BGA head-on-pillow, open or insufficient solder joints, copper dissolution issue and lead-free through-hole barrel filling. Specific defects associated with BTCs and PoPs and the reliability of BTC and PoP assembly will also be outlined.
Tin whiskers will be highlighted on key areas, particularly the mitigating measures and the efficacy ranking of the practical mitigating options.
The course, titled Preventing Production Defects and Product Failures (PD15), will be held on January 28, 2019, from 9:00 to 12:00 pm. It provides a holistic overview of product reliability including the important roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. The course addresses the most prevalent production issues and defects that affect yield, cost and reliability, suitable to all who are involved with or interested in SnPb and Pb-free manufacturing including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.
Main topics to be covered are listed below:
- Premise of production defects and product failure prevention
- Common production defects and issues in lead-free assembly
- Product reliability: Principles
- Product reliability: Solder joint, PCB and component considerations
- PCB pad cratering (vs. pad lifting) causes and solutions
- Open or insufficient solder joints: Different sources, best practices
- BGA head-on-pillow defect: Causes, factors, remedies
- Copper dissolution: Process factors, impact on through-hole joint reliability, mitigation
- Lead-free through-hole barrel filling: Material, process and solder joint integrity
- Defects of BTC and PoP solder joints: Prevention and remedies
- Intermetallic compounds: Fundamentals, characteristics
- Intermetallic compounds: Effects on failure mode, solder joint reliability
- Tin whisker: Applications of concern, practical criteria, testing challenges
- Tin whisker: Growth phenomena, contributing factors, risk mitigation, practical remedies
- Summary
To register, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.
Connect the Dots: How to Avoid Five Common Causes of Board Failure
09/04/2025 | Matt Stevenson -- Column: Connect the DotsBoards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.