Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Dr. Jennie Hwang to Hold Course on Preventing Defects and Failures at IPC APEX EXPO 2019
January 11, 2019 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: 1 minute
Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments in packaging and assembly and with the goal of achieving high yield and reliability in mind, the “how-to” prevent prevailing production defects and product reliability issues through an understanding of potential causes is a necessity.
At the upcoming IPC APEX EXPO 2019 in San Diego, California, Dr. Jennie Hwang will hold a professional development course that will address two selected areas related to product failure—intermetallics and tin whisker—and the top five production defects: PCB pad cratering vs. pad lifting, BGA head-on-pillow, open or insufficient solder joints, copper dissolution issue and lead-free through-hole barrel filling. Specific defects associated with BTCs and PoPs and the reliability of BTC and PoP assembly will also be outlined.
Tin whiskers will be highlighted on key areas, particularly the mitigating measures and the efficacy ranking of the practical mitigating options.
The course, titled Preventing Production Defects and Product Failures (PD15), will be held on January 28, 2019, from 9:00 to 12:00 pm. It provides a holistic overview of product reliability including the important roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. The course addresses the most prevalent production issues and defects that affect yield, cost and reliability, suitable to all who are involved with or interested in SnPb and Pb-free manufacturing including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.
Main topics to be covered are listed below:
- Premise of production defects and product failure prevention
- Common production defects and issues in lead-free assembly
- Product reliability: Principles
- Product reliability: Solder joint, PCB and component considerations
- PCB pad cratering (vs. pad lifting) causes and solutions
- Open or insufficient solder joints: Different sources, best practices
- BGA head-on-pillow defect: Causes, factors, remedies
- Copper dissolution: Process factors, impact on through-hole joint reliability, mitigation
- Lead-free through-hole barrel filling: Material, process and solder joint integrity
- Defects of BTC and PoP solder joints: Prevention and remedies
- Intermetallic compounds: Fundamentals, characteristics
- Intermetallic compounds: Effects on failure mode, solder joint reliability
- Tin whisker: Applications of concern, practical criteria, testing challenges
- Tin whisker: Growth phenomena, contributing factors, risk mitigation, practical remedies
- Summary
To register, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.