Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
iNEMI Survey on New Package Technology Qualification Methodology
January 14, 2019 | iNEMIEstimated reading time: Less than a minute
The International Electronics Manufacturing Initiative (iNEMI) invites you to participate in a survey to help the electronics industry understand package qualification methodologies currently in use and how robust qualification plans are typically generated/developed.
This survey follows up on one conducted earlier this year by iNEMI’s New Packaging Technology Qualification Methodology project. It takes a closer look at the deficiencies and/or gaps in existing test methods and qualification standards identified in the previous survey, and focuses on more detailed information in a few key areas, specifically new package technologies and application spaces. The topics covered in this survey include:
- Test methods
- Qualification standards
- New application use conditions
- New application spaces
- Package qualification methodology tools
Information from the two surveys will be used to recommend a methodology for the development and qualification of new packaging technologies and materials. The project will also report on current best practices for packaging qualification and address the gaps identified by the surveys.
Share on:
Suggested Items
Nokia, Honeywell Aerospace Technologies Partner with Numana to Advance Quantum-safe Networks
04/01/2025 | HoneywellNokia and Honeywell Aerospace Technologies announced a strategic partnership with Numana to advance Quantum-Safe Networks (QSN) in Montreal, Canada, and worldwide.
UNIST Partners with Fincantieri to Advance Eco-Friendly Energy Technologies
03/24/2025 | UNISTUNIST has entered into a strategic partnership with Fincantieri, Europe’s largest shipbuilder based in Trieste, Italy. Together, the two organizations aim to foster open innovation in the development of eco-friendly energy technologies through robust industry-university collaboration and support for technology startups.
Imec, ZEISS Intensify Collaboration with the Signing of a New Strategic Partnership Agreement
03/24/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and ZEISS Semiconductor Manufacturing Technology (SMT), a leading technology company in the optical and optoelectronic industry and supplier of key components for the production of microchips, are intensifying their collaboration to advance the NanoIC pilot line at imec with state-of-the-art semiconductor technology and manufacturing expertise for sub-2nm research and development.
STMicroelectronics Recognized as Top 100 Global Innovator 2025 for the Seventh Time
03/24/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has been named in the Top 100 Global Innovators 2025.
Ansys to Integrate NVIDIA Omniverse
03/20/2025 | ANSYSAnsys announced it will offer advanced data processing and visualization capabilities, powered by integrations with NVIDIA Omniverse within select products, starting with Fluent and AVxcelerate Sensors.