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iNEMI Survey on New Package Technology Qualification Methodology
January 14, 2019 | iNEMIEstimated reading time: Less than a minute
The International Electronics Manufacturing Initiative (iNEMI) invites you to participate in a survey to help the electronics industry understand package qualification methodologies currently in use and how robust qualification plans are typically generated/developed.
This survey follows up on one conducted earlier this year by iNEMI’s New Packaging Technology Qualification Methodology project. It takes a closer look at the deficiencies and/or gaps in existing test methods and qualification standards identified in the previous survey, and focuses on more detailed information in a few key areas, specifically new package technologies and application spaces. The topics covered in this survey include:
- Test methods
- Qualification standards
- New application use conditions
- New application spaces
- Package qualification methodology tools
Information from the two surveys will be used to recommend a methodology for the development and qualification of new packaging technologies and materials. The project will also report on current best practices for packaging qualification and address the gaps identified by the surveys.
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"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
HyRel’s Brian Watson Named Candidate for SMTA Board of Directors
07/25/2025 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to announce that its Founder, Brian Watson, has been named a 2025 candidate for the SMTA Board of Directors.
Exro Provides Update on Facility Milestones
07/17/2025 | PRNewswireExro Technologies Inc., a leading clean technology company specializing in power control solutions for electric vehicles and energy storage, provides a further update on the satisfaction of the near-term strategic milestones established in connection with the company's US$30 million credit facility announced on May 16, 2025.
Flexible Circuit Technologies Welcomes Regional Business Development Manager Derek Rossberg
07/15/2025 | Flexible Circuit TechnologiesFlexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Derek Rossberg as Regional Business Development Manager.
TTM Technologies Prepares For the Future with the Acquisition of a Facility in Wisconsin and Land in Penang
07/10/2025 | Globe NewswireTTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (PCB), announced the acquisition of a 750,000-square-foot facility in Eau Claire, Wisconsin, as well as land rights for an additional future manufacturing site in Penang, Malaysia.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).