-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Welcomes Brook Sandy-Smith as New Technical Education Program Manager
January 14, 2019 | IPCEstimated reading time: 2 minutes
IPC—Association Connecting Electronics Industries announces the addition of Brook Sandy-Smith as technical education program manager, to its staff at IPC headquarters in Bannockburn (Chicago), Illinois.
As manager of IPC’s technical educational program, Sandy-Smith will be responsible for content development and successful execution of IPC’s educational programs and technical proceedings for conferences, webinars, workshops, tutorials and professional development offerings for the electronics industry. She will lead the development and execution of the technical program and professional development curriculum components of the organization’s trade show events, specialty conferences and professional development events.
An experienced materials, process and applications engineer, Sandy-Smith has expertise in solving complex technical challenges, managing projects with multidisciplinary teams, and is an award-winning participant in electronics industry organizations, including three IPC distinguished committee service awards.
Prior to joining IPC, Sandy-Smith served as a senior technical support engineer and PCB assembly materials specialist at Indium Corporation, where she provided customer support of process and application development, was the preferred SMT expert for line audits and implementation of new designs and materials, and cultivated industry partnerships with equipment companies to understand new technologies in the industry. She also developed and standardized solder past test protocol and participated in training new engineers and engineering teams across the globe. An experienced presenter and author of many technical papers, Sandy-Smith won Indium Corporations’ best paper of 2016 and 2017. A graduate of the University of Rhode Island and Wilhemina Technical University in Braunschweig, Germany, Sandy-Smith is also an SMTA certified process engineer.
“We are thrilled to welcome Brook to IPC,” said Alicia Balonek, senior director, tradeshows and events. “With her extensive knowledge of the electronics manufacturing industry and IPC, she is a perfect fit as we work to create more relevant technical education programs for our membership.”
About IPC
IPC is a global industry association based in Bannockburn, Illinois, dedicated to the competitive excellence and financial success of its 4,900 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.