The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
Orange County Chapter of the DC Designers Council Meeting January 22
January 15, 2019 | Scott McCurdy, Freedom CAD ServicesEstimated reading time: 1 minute
The Orange County Chapter of the DC Designers Council will hold its January Lunch ‘n’ Learn meeting January 22, John Carney, an application engineer at Cadence Design Systems, will be the featured presenter. He has an EE degree and supports all of the Allegro and Sigrity products.
John will be presenting on two topics:
First presentation:
“Signal Integrity Effects of Different PCB Structures”
This presentation will discuss the following:
- Return path vias for single-ended and differential pairs.
- How the void around the differential via pair structure effects signal integrity.
- How back-drilling effects signal integrity and an eye diagram.
- Fiber weave effects.
- Tabbed routing.
- Inductive compensation.
Second presentation:
“Artificial Intelligence and Machine Learning Basics, and How it Will Affect PCB Design”
This presentation will discuss the following:
- Machine Learning vs Artificial intelligence vs deep learning.
- How a machine “learns”
- PCB based examples of different types of Machine Learning.
- DARPA’s plans for AI and PCB design
- Other examples from industry leaders
Reserve a spot on your calendar for Tuesday, January 22 from 11:30 am to 1:30 pm for this educational “Lunch ‘n’ Learn” event.
Location
Harvard Athletic Park multi-purpose room (at the SOUTH end of the athletic fields)
14701 Harvard Avenue
Irvine, California 92606
The cost to attend this Lunch ‘n Learn event will be $10 at the door. Lunch will be sponsored by EMA Design Automation. Several prizes will be raffled off, including a six-month OrCAD license.
Please RSVP no later than noon on Monday, January 21
There are TWO ways to RSVP:
- RSVP online by clicking here.
- Or email your RSVP to terri_kleekamp@mentor.com
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Driving Innovation: Mastering Panel Warpage
09/23/2025 | Simon Khesin -- Column: Driving InnovationDuring the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/26/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/28/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.
New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.