-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Technology Highlighting Expanded Inspection Capabilities at IPC APEX EXPO 2019
January 15, 2019 | Koh Young TechnologyEstimated reading time: 1 minute

As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology will show how its true 3D solutions can improve production throughput and yield at the IPC APEX EXPO during 29-31 January 2019 in San Diego, California. This year, Koh Young will display an array of new inspection systems with expanded capabilities at booth 1908 in the San Diego Convention Center.
Leveraging its core strengths in robotics and true 3D measurement, Koh Young will bring the next generation of accuracy to the pin inspection, machined parts, and semiconductor inspection markets. The new Koh Young KY-P3 delivers true 3D inspection data for single array, forked, press-fit, and other pin configurations for final optical inspection (FOI) with applications like engine control units. The system also measures pin height, solder height, and pin tip separation with the highest accuracy and repeatability.
Koh Young will also highlight its latest Machining Optical Inspection (MOI) system. Developed around its core 3D measurement technologies, the MOI system inspects metal case surfaces for scratches, cracks, and stains, along with height, diameter, volume, and more. Committed to bringing about “Smart Manufacturing” innovations, the MOI system delivers both visual and process inspection simultaneously, which improves process yield and reduces false calls.
Beyond pin and machined part inspection capabilities, Koh Young will present the latest Meister D solution focused on the SiP (System-in-Package) assembly process. The new machine improves production yields on high density modules comprised of bare die and passives by integrating defect analysis and metrology software. With small sized component inspection down to 008004 inch, the system overcomes challenges in semiconductor packaging, which are compounded by chip stacking and wafer thinning. What’s more, the system also allows machine learning-based crack inspection.
As the absolute leader in 3D inspection market, Koh Young will also take part in several show activities like topical roundtable discussions and interviews on the smart factory and inspection process.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.