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Koh Young Technology Highlighting Expanded Inspection Capabilities at IPC APEX EXPO 2019
January 15, 2019 | Koh Young TechnologyEstimated reading time: 1 minute
As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology will show how its true 3D solutions can improve production throughput and yield at the IPC APEX EXPO during 29-31 January 2019 in San Diego, California. This year, Koh Young will display an array of new inspection systems with expanded capabilities at booth 1908 in the San Diego Convention Center.
Leveraging its core strengths in robotics and true 3D measurement, Koh Young will bring the next generation of accuracy to the pin inspection, machined parts, and semiconductor inspection markets. The new Koh Young KY-P3 delivers true 3D inspection data for single array, forked, press-fit, and other pin configurations for final optical inspection (FOI) with applications like engine control units. The system also measures pin height, solder height, and pin tip separation with the highest accuracy and repeatability.
Koh Young will also highlight its latest Machining Optical Inspection (MOI) system. Developed around its core 3D measurement technologies, the MOI system inspects metal case surfaces for scratches, cracks, and stains, along with height, diameter, volume, and more. Committed to bringing about “Smart Manufacturing” innovations, the MOI system delivers both visual and process inspection simultaneously, which improves process yield and reduces false calls.
Beyond pin and machined part inspection capabilities, Koh Young will present the latest Meister D solution focused on the SiP (System-in-Package) assembly process. The new machine improves production yields on high density modules comprised of bare die and passives by integrating defect analysis and metrology software. With small sized component inspection down to 008004 inch, the system overcomes challenges in semiconductor packaging, which are compounded by chip stacking and wafer thinning. What’s more, the system also allows machine learning-based crack inspection.
As the absolute leader in 3D inspection market, Koh Young will also take part in several show activities like topical roundtable discussions and interviews on the smart factory and inspection process.
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