-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson DIMA to Demonstrate Hot Bar Reflow Soldering and Automated Flux Dispensing with the C-TurnFlux System at IPC APEX EXPO 2019
January 16, 2019 | Nordson DIMAEstimated reading time: 1 minute
Nordson DIMA, a division of Nordson Corporation, will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering, at the IPC APEX Expo, San Diego, California - its first live demonstration in North America. The C-TurnFlux combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications.
The C-TurnFlux hot bar reflow system is used to solder a range of assemblies, such as an LCD with flex attached to a PCB, multiple wires to a PCB board, or connectors and other components. It enables soldering for processes that require two soldering connections per product or simultaneous soldering of two small products.
The heating process is easy to program using pulsed heat technology. Short heating and cool-down times result in extremely short process cycles. Thermode/hot bar design offers an easy, fast, and reliable exchange of thermodes and ensures co-planarity of solder joints. The programmable automated flux dispensing process with constant fluid dispense volumes contributes to consistent product quality.
The C-TurnFlux system has two configurations. One has two soldering heads and automated flux dispensing for high-throughput, high-volume manufacturing. The second has one soldering head with automated flux dispensing and one quality inspection module for applications that demand higher quality and output.
About Nordson DIMA
Nordson DIMA serves the global market with hot bar bonding and soldering application solutions and offers a range of dispensing and coating products exclusively for the European region. The customer-inspired systems support a range of different industries, like electronics, automotive, medical, aerospace, defense, and solar/energy. The company offers a wide variety of solutions, ranging from high quality standard systems and process equipment to completely automated production lines; from concept discussions to global installation and production ramp up.
About Nordson Corporation
Nordson Corporation is one of the world's leading producers of precision dispensing equipment that applies adhesives, sealants, coatings, and other materials to a broad range of consumer and industrial products during manufacturing operations. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for curing and surface treatment processes. Headquartered in Westlake, Ohio, Nordson has direct operations and sales support offices in more than 30 countries.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.