Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Flex Ltd. Comments on IPC Executive Forum for Advancing Automotive Electronics
January 16, 2019 | Gene Weiner, Weiner International Inc.Estimated reading time: 1 minute
After reviewing the Executive Forum for Advancing Automotive Electronics program and Gene Weiner's comment about how the topics presented apply to military and flexible circuits as well as 5G needs, Dr. Joan K. Vrtis, Senior Vice President of Flex Ltd, has this to say:
"This has been a trend for the past five years with solid progress. The adoption of advancing manufacturing with Factory 4.0 principles has given way to PCB technology with 20/20 µm L/S and 200 µm pitch with 50 µm microvia copper filled and stacked to 12 layers—think ELIC or ALIVH on steroids. This allows for direct chip attach and fan in/out options for the next generation of IOT or other chipsets. SiP and modules are a significant part of the 5G solution. Advanced materials, mixed mode laser (CO2/UV) used in substrate-like feature definition, and new copper-plate via fill chemistries are adopted to standard PCBs to meet the needs of these higher density features."
It's not too late to register for this not-to-be-missed event. There will be something useful presented that will be of value to the management of every fabricator!
Registration information for the Executive Forum on Advancing Automotive Electronics is available online at www.ipcapexexpo.org.
For further information, contact Forum Chairman Gene Weiner at gene@weiner-intl.com or Tracy Riggan, senior director, IPC Member Support at TracyRiggan@ipc.org.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.