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Flex Ltd. Comments on IPC Executive Forum for Advancing Automotive Electronics
January 16, 2019 | Gene Weiner, Weiner International Inc.Estimated reading time: 1 minute
After reviewing the Executive Forum for Advancing Automotive Electronics program and Gene Weiner's comment about how the topics presented apply to military and flexible circuits as well as 5G needs, Dr. Joan K. Vrtis, Senior Vice President of Flex Ltd, has this to say:
"This has been a trend for the past five years with solid progress. The adoption of advancing manufacturing with Factory 4.0 principles has given way to PCB technology with 20/20 µm L/S and 200 µm pitch with 50 µm microvia copper filled and stacked to 12 layers—think ELIC or ALIVH on steroids. This allows for direct chip attach and fan in/out options for the next generation of IOT or other chipsets. SiP and modules are a significant part of the 5G solution. Advanced materials, mixed mode laser (CO2/UV) used in substrate-like feature definition, and new copper-plate via fill chemistries are adopted to standard PCBs to meet the needs of these higher density features."
It's not too late to register for this not-to-be-missed event. There will be something useful presented that will be of value to the management of every fabricator!
Registration information for the Executive Forum on Advancing Automotive Electronics is available online at www.ipcapexexpo.org.
For further information, contact Forum Chairman Gene Weiner at gene@weiner-intl.com or Tracy Riggan, senior director, IPC Member Support at TracyRiggan@ipc.org.
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Rachael Temple - AlltematedSuggested Items
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Foxconn, TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/30/2025 | PRNewswireHon Hai Technology Group (Foxconn) and TECO Electric & Machinery Co Ltd Ltd (TECO) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.
Sypris Wins Awards to Support Subsea Cable Systems
07/29/2025 | BUSINESS WIRESypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced it has secured follow-on contract awards from a leading global provider of subsea cable systems. Under the terms of the agreement,
Creating Connections in Mexico
07/30/2025 | Michelle Te, Community MagazineA concerted effort by the Global Electronics Association—Mexico team over the past year has created inroads for the Global Electronics Association (formerly IPC) with leading electronics companies, government offices, and academic institutions in Mexico. “Our goal is to bring more awareness to what the Global Electronics Association is and what it offers,” says Lorena Villanueva, senior director. “We also aim to increase our membership. Of 3,200 members of the Global Electronics Association, only 180 are in Mexico.”
North American EMS Industry Down 8.9% in June
07/29/2025 | Global Electronics AssociationThe Global Electronics Association announced today the June 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.28.