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January 18, 2019 | Rehm Thermal SystemsEstimated reading time: 1 minute
Rehm seminar in Mexico scheduled for mid-February What are the causes of soldering defects? And what methods can be used to avoid precisely such soldering defects? Answers to these questions will be provided at a two-day Rehm seminar to be held at the Rehm Technology Centre in Guadalajara, Mexico on February 13 and 14.
Luis Garcia, managing director of Rehm Mexico, will present the most important news as well as Rehm's portfolio and innovations to the seminar participants. The first seminar day, dedicated entirely to reflow profiling, will then begin. Dr. Hans Bell, Head of R&D at Rehm Thermal Systems, will present the reflow profiling basics: standards, guidelines, measurement options, and factors affecting the reflow profile. The effect of process-related factors on soldering quality, such as wetting, will be examined in the afternoon.
Defect management in electronics production will be the main topic on the second day of the seminar. Dr. Hans Bell will take a look at reflow soldering defects such as solder balling/spatter or solder beading – while explaining the causes of voids and strategies to prevent these. Both seminar days will offer enough discussion time for participants to exchange specialist information.
About Rehm Thermal Systems
As a specialist in thermal system solutions for the electronics and photovoltaics industry, Rehm is a technology and innovation leader in state of-the-art, cost-effective manufacturing of electronic assemblies. We are a globally active manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallization of solar cells as well as numerous customized systems. We have a presence in all key growth markets and, with more than 25 years of industry experience, we are able to implement innovative production solutions that set new standards.
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