-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson YESTECH to Demo Dual-Sided PTH AOI at IPC APEX EXPO
January 22, 2019 | Nordson YESTECHEstimated reading time: 2 minutes
Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry, will feature the latest revision of the FX-942 dual sided automated optical inspection (AOI) system for solder and plated through-hole (PTH) applications at the IPC APEX EXPO 2019 in San Diego, California. During the exhibition, Nordson YESTECH will conduct live demonstrations in the booth of their complete line of AOI and conformal coat inspection (ACI) systems.
Nordson YESTECH’s FX-942 dual sided AOI system is ideally suited to inspect the unique challenges of plated through hole (PTH) assemblies, offering full defect coverage, inspecting solder joints and verifying correct assembly. The FX-942 ideally complements Nordson SELECT’s Selective Soldering systems providing inspection capabilities for demanding soldering applications.
The FX-942 saves valuable inspection time by providing high-speed automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts featuring:
- Dual sided imaging with full travel imaging sensors
- 1 vertical and 4 optional angle cameras per side
- Up to 100 mm clearance
- High speed inspection and transfer
- High defect coverage / low false failure
- Picture in Picture (P-in-P) feature
- MES / Industry 4.0 compatible
Programming the FX-942 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The FX-942 utilizes a
standard package library to simplify training and ensure program portability across manufacturing lines.
“We are excited to showcase our latest inspection solutions for 2019 at Apex,” said Don Miller, Nordson YESTECH general manager. “This is the ideal venue to meet with our valued customers and discuss our latest advancements in optical, X-ray and acoustic inspection technologies.”
About IPC APEX EXPO 2019
The electronics industry’s own event – a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, learn from new research papers and return to your company with the solutions you need. For more information about IPC APEX EXPO 2019 and to register, visit http://www.goipcshows.org.
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical systems with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.