-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Technology to Highlight Next-Level Connectivity at IPC APEX EXPO 2019
January 22, 2019 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology, the industry’s leading smart factory solutions provider, will highlight latest process optimization solution with its KY8030-3 3D SPI for solder paste printing at IPC APEX EXPO 2019 show during 29-31 January 2019 at the San Diego convention center. The Koh Young Process Optimizer (KPO) solution is a comprehensive process optimization solution suite, which maximizes throughput and increases ROI by recommending optimal print parameters.
The Koh Young Process Optimizer (KPO), which recently accepted the award for Best Process Control Software at the Mexico EMS Technology Award ceremony, is Koh Young’s long-awaited realization of the desire to contribute to the evolution of industrial innovations. KPO, comprised of several interlinking software modules, automatically analyzes SPI data in real-time, recommends print parameters based on DOE results, and alerts operators to print process issues with real-time AI-based monitoring of SPI results. An intuitive, graphical user interface puts real-time data analytics at the forefront (Figure 1).
Figure 1: Example images of the KPO software User Interface
By incorporating Koh Young’s true 3D measurement data, KPO allows manufacturers to quantitatively manage printer settings and optimization time without highly experienced operators. Beyond its industry-leading accuracy, KPO verifies DOE-tested parameters with new DOE Reliability Report; which shows how reliable conducted DOE is before recommending the optimal parameters. The engine also allows the user to remove and rerun outliers to enhance the reliability and the fitness of DOE modelling. With KPO, SPI goes far beyond catching good board/bad board.
Moreover, Koh Young will also show the latest KSMART solution, which leverages true 3D measurement data to help manufacturers operate lines more efficiently. For instance, the LM@KSMART (Library Manager) module simultaneously deploys stored programs and inspection conditions across multiple lines, while RTM@KSMART (Real Time Monitoring) displays relevant process parameters to remote locations for immediate analysis. The latest KSMART solution performs with improved usability and versatility, where users can simply click through menus to drill down into details for the information needed.
As the absolute leader in the SPI and AOI market with over 13,000 machines delivered worldwide, Koh Young will showcase a broad set of its latest developments, including the new KY-P3 pin inspection solution and Meister D semiconductor solution. Koh Young will also take part in several show activities like topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at booth 1908.
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.