Indium Engaging Attendees on IPC APEX EXPO Show Floor

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Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company’s proven products live on the show floor, as well as an opportunity to meet with their voiding experts, from January 29-31 in San Diego, California.

These live production line demonstrations support Indium Corporation’s ongoing commitment to accurate and honest depictions of the company’s material performance. Celebrating its 15th anniversary this year, the “Live@APEX” program benefits all participants, including Indium Corporation, its industry partners, and, most importantly, customers.

This year’s featured partners include:

• AIR-VAC Engineering, booth 1625
• American Hakko Products, Inc., booth 1933
• Apollo Seiko, booth 1123
• ASYS Group Americas Inc., booth 2720
• Finetech, booth 2427
• GPD Global, booth 2915
• ITW EAE, booth 3339
• JBC Tools USA, Inc., booth 3033
• Koh Young Technology, booth 1908
• Marco Dachau, booth 1216
• Metcal, booth 1314
• PARMI USA, Inc., booth 1307
• Pillarhouse USA, booth 1715
• Smart Sonic, booth 1239
• Techcon Systems, booth 1314
• Universal Instruments Corp., booth 2308
• Yamaha, booth 942
• Zestron, booth 3323

If you see an Indium Corporation product running in a booth, be sure to Tweet and tag @IndiumCorp or use the hashtag #LiveatAPEX.

To learn more about the Live@APEX program, contact Miloš Lazić, Technical Support Engineer, or visit Indium Corporation at booth #3133.

In addition to the live show floor demonstrations, Indium Corporation andKIC will hold a voiding clinic at booth #1215 between 1 and 3 p.m. on Tuesday and Wednesday, January 29-30.

The most effective way to reduce voiding in solder joints is to analyze the assembly process from both a materials perspective and from a reflow profiling perspective. Voiding experts from both Indium Corporation and KIC will be on hand to analyze customers’ soldering processes and recommend adjustments to help them minimize their solder joint voiding.

KIC is a recognized leader in automated thermal process tools and systems for reflow, wave, curing, and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and has created the next generation of thermal systems to help manufacturers improve thermal process quality and reduce costs.

The IPC CFX Industry 4.0 Digital Factory demonstrations will run Indium Corporation’s materials in two live production lines throughout all three days of the event. Products from the company’s lines of lead-free, no-clean solder pastes and flux-cored solder wire will be featured.

IPC CFX Industry 4.0 Digital Factory is designed to illustrate the achievements made in digital industry technology standards development over the past year. The first line will feature both the HERMES standard (IPC-9852) and IPC’s Connected Factory eXchange (CFX) Internet of Things messaging standard (IPC-2591), working together to deliver SMT automation value. The second line will feature the wider application of IPC CFX across multiple technologies of assembly production, including manual processes. 

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.