-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Aegis Software Announces New Integration with OMRON for Superior Data Collection and Quality
January 24, 2019 | Aegis SoftwareEstimated reading time: 2 minutes
Aegis Software announces that Aegis’ FactoryLogix MES platform is integrated with Omron Inspection Systems’ complete suite of award-winning SPI (solder paste inspection) and AOI (automated optical inspection) systems. This integration will provide Omron’s customers with improved quality control and an enhanced, automated method for identifying and collecting manufacturing defect data during inspections.
When used in conjunction with the rich CAD (Computer Aided Design) environment, enabled by FactoryLogix, the robust output data from Omron’s AOI and SPI machines facilitates a digital view of the collected defect data that extends down to the pin level. Traditional methods of identifying defects, such as manual, paper-based reports, are no longer necessary.
Data collected from Omron is recorded automatically into the FactoryLogix database providing a single source device history of the product for instantaneous reporting without the need to manually export the raw data to an external source. Based on the collected pass and fail data, FactoryLogix can intelligently reroute the product to the appropriate reroute path. This increased efficiency and adaptability in production saves both time and money for manufacturers.
“This new integration capability will give our customers the benefit of advanced defect collection, resulting in enhanced quality control. Omron is excited to partner with Aegis on this integration as our customers require holistic and synchronized solutions that further promote quality outcomes, increased productivity, and risk mitigation,” stated Tim Anderson, key accounts manager, Omron.
FactoryLogix is a holistic and modular platform which delivers leading-edge technology with easily configurable modules to support and execute a discrete manufacturer’s strategy towards Industry 4.0. FactoryLogix manages the entire manufacturing lifecycle: from product launch to material logistics, through manufacturing execution and quality management, to powerful analytics and real-time dashboards. This end-to-end platform is helping companies accelerate product introductions, streamline processes, improve quality and traceability, reduce costs and gain greater visibility for competitive advantage and profitability.
FactoryLogix solution areas include: Digital Manufacturing Engineering (DME); Manufacturing Process Execution; Returns, Repairs, Rework, Overhaul (RMA/MRO); Lean Materials Management; Adaptive Planning; Quality Management Solution (QMS); Regulatory & Customer Compliance; Manufacturing Intelligence; Active Rules Engine; Connectivity (IIoT & Business Systems).
About Aegis Software
Founded in 1997, Aegis Software uniquely delivers a comprehensive and flexible end-to-end manufacturing execution system (MES) platform giving manufacturers the speed, control, and visibility they require. Aegis has international sales and support offices in Germany, UK, and China, and partners with more than 37 manufacturing equipment suppliers. Since its inception, Aegis has been helping more than 2,000 factories across the military, aerospace, electronics, medical, and automotive industries, drive rapid and continuous innovation with the highest quality while reducing operational costs.
About Omron Inspection Systems
Omron Inspection Systems continues to build upon a 30 year history and reputation of setting the standard for high quality and reliable SPI, AOI and AXI solutions. Inspection accuracy, capability, stability and speed are achieved through innovative design, advanced hardware and 2D/3D/CT imaging technology. Powerful software tools also provide true offline productivity, a real path towards Industry 4.0 and quality analysis capabilities that yield real process improvements. As an automation industry leader, Omron designs products that are integrated, intelligent and interactive to become your trusted partner for inspection.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.