-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
In the Studio: Real Time with…IPC
January 25, 2019 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

It's almost time for IPC APEX EXPO 2019 at the San Diego Convention Center, and that means another Real Time with…IPC video program bringing you interviews with the electronics industry's top movers and shakers, engineers, and managers. It's hard to believe that Real Time with…IPC has been a staple of IPC APEX EXPO since 2007.
I still remember my first Real Time with…IPC at IPC APEX EXPO 2008 in Las Vegas quite well. I had just begun doing video interviews, and to say I was a little rough is an understatement. Publisher Barry Matties had given me some training beforehand, but I was still trying to find my groove.
My first interview went along pretty well; so far, so good. Then, the engineer I was interviewing stopped talking and I couldn't think of a good follow-up question to ask. I looked around, trying to find inspiration for another question, and saw Barry raise one eyebrow at me and start smiling. We all started laughing. Finally, he said, "Don't look at me, focus on who you're interviewing."
That turned out to be good advice because an interviewer has to tune out everything except the person being interviewed, no matter where you are, and I'm usually surrounded by distractions at IPC APEX EXPO. Pick-and-place machines and vacuums always seem to be running. If we're doing a show wrap-up interview as the event is breaking down, a forklift driver will usually pull up next to us and drop a half dozen pallets. Once I tuned out the distractions, I could focus on the interview like a hunter’s gun-proofed retriever.
Then and Now
Things have certainly changed since 2008. For one thing, I’ve gotten much better at doing on-camera interviews; of course, after those first attempts, there was really nowhere to go but up.
We’ve also added a whole range of guest editors—many of them are people just like you—who conduct fantastic interviews with individuals in their segment of the industry. No matter what topic the interviewee wants to discuss, we probably have a guest editor who is familiar with that topic. Some of our guest editors have been doing Real Time with…IPC interviews for a decade, and we couldn’t do it without them.
The technology we use today is also light years ahead. In 2008, we used our big old-school camcorders that still ran on tape, and our video editing operations sometimes took well into the night. Now, we shoot interviews with digital recorders; editing is finished before the show closes each day, and most of that day’s interviews are posted on the Real Time with… site on the same day.
To read the full article, which appeared in the December 2018 issue of SMT007 Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.