-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Saki's AOI Systems are First to be Certified by Panasonic for APC-MFB2 System
January 28, 2019 | Saki CorporationEstimated reading time: 2 minutes

Saki Corporation, an innovator an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that SAKI's automated optical inspection (AOI) systems are the first AOI systems certified to support Panasonic's latest Advanced Process Control-Mounted Feedback (APC-MFB2 ) system. Field tests conducted using SAKI's 3D AOI systems to provide feedback data to Panasonic's APC-MFB2 system resulted in maximization of overall equipment effectiveness (OEE) through increases in process stability and yield. The entire lineup of SAKI 3D AOI systems, in all available image resolutions, including 7µm, 12µm, and 18µm, were certified.
SAKI's 3D AOI system inspects and measures the printed circuit board during the assembly process and feeds measurement results for the components' actual location to the Panasonic NPM series pick-and-place system to ensure mounting position accuracy. The system uses measurement results from SAKI's 3D AOI to analyze placement offset trends and optimize performance to improve SMT production-line process repeatability, accuracy, and yield. APC-MFB2 is an extension of Panasonic's APC-MFB and handles multiple package types such as small-outline and grid array packages.
"We are honored to enter this successful partnership with Panasonic Smart Factory Solutions," said Yoshihiro Akiyama, CTO for SAKI Corporation. "SAKI has always focused on the quality of the data and the accuracy of the measurements that our equipment communicates to the other systems in the SMT line. Thanks to APC-MFB2, feedback can be independent of general variations often found in the components. The process is constantly monitored by a built-in self-diagnostic functionality in the AOI software, elevating machine accuracy and repeatability to the highest level. This is a very important aspect for yield improvement, not only in the pre-reflow process, but in the entire SMT line for meeting M2M connection requirements."
SAKI will be exhibiting this new breakthrough technology for Smart Factory, along with its 3D AOI, SPI, AXI, 2D bottom-side AOI, and award-winning Saki Self-Programming Software, at IPC APEX Expo, January 29-31, San Diego, California, in booth #1407.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.