-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Saki's AOI Systems are First to be Certified by Panasonic for APC-MFB2 System
January 28, 2019 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that SAKI's automated optical inspection (AOI) systems are the first AOI systems certified to support Panasonic's latest Advanced Process Control-Mounted Feedback (APC-MFB2 ) system. Field tests conducted using SAKI's 3D AOI systems to provide feedback data to Panasonic's APC-MFB2 system resulted in maximization of overall equipment effectiveness (OEE) through increases in process stability and yield. The entire lineup of SAKI 3D AOI systems, in all available image resolutions, including 7µm, 12µm, and 18µm, were certified.
SAKI's 3D AOI system inspects and measures the printed circuit board during the assembly process and feeds measurement results for the components' actual location to the Panasonic NPM series pick-and-place system to ensure mounting position accuracy. The system uses measurement results from SAKI's 3D AOI to analyze placement offset trends and optimize performance to improve SMT production-line process repeatability, accuracy, and yield. APC-MFB2 is an extension of Panasonic's APC-MFB and handles multiple package types such as small-outline and grid array packages.
"We are honored to enter this successful partnership with Panasonic Smart Factory Solutions," said Yoshihiro Akiyama, CTO for SAKI Corporation. "SAKI has always focused on the quality of the data and the accuracy of the measurements that our equipment communicates to the other systems in the SMT line. Thanks to APC-MFB2, feedback can be independent of general variations often found in the components. The process is constantly monitored by a built-in self-diagnostic functionality in the AOI software, elevating machine accuracy and repeatability to the highest level. This is a very important aspect for yield improvement, not only in the pre-reflow process, but in the entire SMT line for meeting M2M connection requirements."
SAKI will be exhibiting this new breakthrough technology for Smart Factory, along with its 3D AOI, SPI, AXI, 2D bottom-side AOI, and award-winning Saki Self-Programming Software, at IPC APEX Expo, January 29-31, San Diego, California, in booth #1407.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.