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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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National Instruments App Note Demos EM Verification of Complex PCBs
January 29, 2019 | National InstrumentsEstimated reading time: Less than a minute
A new NI AWR software application note presents an example highlighting the enhanced PCB import wizard within the NI AWR Design Environment platform. The wizard simplifies and accelerates electromagnetic (EM) analysis of complex PCBs by enabling designers to isolate and characterize critical traces within complex multi-layer configurations in order to streamline EM verification.
The “EM Verification of Complex Board Structures Streamlined With PCB Import Wizard” application note is available by clicking here.
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SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium
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Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.