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Sondrel Announces Two New Design Contract Wins

02/29/2024 | Sondrel
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.

IPC White Paper Emphasizes Critical Importance of Data Analytics for Electronics Manufacturing Process

02/26/2024 | IPC
The increasing complexity of electronics manufacturing requires embracing data analytics to manage electronics factories, according to a new white paper from IPC’s Chief Technologist Council (CTC), "Outlook for Data Analytics in the Electronics Manufacturing Industry."

Rocket Lab to Launch NRO Mission from Wallops, Virginia

02/21/2024 | BUSINESS WIRE
Rocket Lab USA, Inc. , a global leader in launch services and space systems, today announced it will launch a dedicated mission for the National Reconnaissance Office (NRO) from Launch Complex 2 in Wallops, Virginia, during a launch window that opens March 20th, 2024.

NTERCHIP Achieves 3x Faster Verification for VCXO with Siemens’ Advanced Analog and Mixed-signal EDA Technology

01/30/2024 | Siemens
Siemens Digital Industries Software announced that INTERCHIP CORPORATION, a leading fabless semiconductor company specializing in high precision, low power oscillator products, used Siemens‘ Analog FastSPICE platform and Symphony™ platform to verify its newest IPV Voltage-Controlled Crystal Oscillator (VCXO) integrated circuit (IC) and IPS Simple Packaged Crystal Oscillator (SPXO).

Cetec ERP Showcases Cloud ERP Solutions Tailored for Wire Harness & Cable Assembly at WHMA Summit

01/18/2024 | Cetec ERP
Cetec ERP, a leading cloud ERP software provider, is pleased to announce its participation in the upcoming Wire Harness Manufacturer's Association (WHMA) Annual Global Leadership Summit. As an exhibitor in Booth 404, Cetec ERP will present its innovative web-based ERP solutions tailored for Wire Harness & Cable Assembly.
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