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RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues
January 30, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components. They also talk about how the vacuum reflow technology is being seen as a process to help reduce voiding, and MacDermid Alpha’s Void Reduction Solutions (VRS).
To watch the interview, click here.
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