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Advanced Electronics Packaging Digest

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Silicon Labs Opens New Austin Innovation Center with Support from Texas CHIPS Act

09/09/2026 | Silicon Labs
Silicon Labs, the leader in low-power wireless connectivity, celebrated the opening of its new research and development (R&D) laboratory for advanced chip design and testing in Austin.

HyperLight Welcomes VentureTech Alliance to Series C

09/09/2026 | BUSINESS WIRE
HyperLight Corporation, a leader in thin-film lithium niobate (TFLN) photonics, announced that VentureTech Alliance (VTA) has joined its Series C financing round.

DYCONEX Establishes BIOCONEX to Extend its Medical Technology Portfolio

09/09/2026 | DYCONEX
DYCONEX AG announces the establishment of BIOCONEX AG, a wholly owned Swiss subsidiary dedicated to transforming substrate technologies manufactured by DYCONEX into customer-specific, ready-to-integrate sub-components for medical devices.

Backpedaling on Requirement to get Chinese Printed Circuit Boards out of the Defense Industrial Base is Unacceptable

09/09/2026 | PCBAA
Five years ago, Congress provided guidance to the Pentagon to create a plan to remove Chinese, Russian, Iranian, and North Korean content from critical defense supply chains: certainly adequate time for this important work to be done.

Fujitsu Develops Diamond-spin Quantum Computer Prototype

09/08/2026 | JCN Newswire
Fujitsu announced that it has developed the world’s first working prototype of a diamond-spin quantum computer incorporating tin-vacancy (SnV) centers into photonic integrated circuits.
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