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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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EMA Webinar: Don’t Let Your Design Data Manage YouFebruary 5, 2019 | EMA Design Automation
Estimated reading time: Less than a minute
With the mounting pressure engineers face to make everything "better, faster, cheaper, smaller" in less time, managing your design data can seem like the least of your concerns. However, data management issues can sink a project just as fast as any design flaw. Effectively managing your design data is a critical piece to ensuring overall project success.
Don’t learn through trial-and-error. Register now for this free webinar, scheduled for Wednesday, February 20, 2019 at 2 pm EDT. Get the critical design data management tips and best practices info you need from the experts at EMA Design Automation and xPLM.
Attendees will learn:
- Why PCB design data management is the key to sustained design success
- Common issues and points of failure as well as how to identify and overcome them
- How to ensure BOM, Design, and Part data are always up-to-date and in-sync
- Why connecting your data to the rest of the organization is important
- How to easily and effectively manage your design data directly inside your CAD environment
For more information, or to register, click here.
Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry02/29/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.