Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
IPC Names Rising Star Awardees at IPC APEX EXPO 2019
February 6, 2019 | IPCEstimated reading time: 1 minute
In recognition of their leadership and contributions to IPC and the electronics industry within the past five years, IPC presented IPC Rising Star awards to Milea Kammer, Ph.D., Honeywell Aerospace; Matt Kelly, IBM; Hans-Peter Tranitz, Ph.D., Continental Automotive, GmbH; and MaryAlice Gill, Jabil Circuit at IPC APEX EXPO 2019
The IPC Rising Star award is given to individuals who have shown significant leadership ability in the past five years, making an impact on IPC and the electronics industry because of their support for IPC standards, education, advocacy and solutions to industry challenges.
Dr. Milea Kammer, a materials engineering technical manager at Honeywell Aerospace, is the co-chair for the IPC J-STD-001 committee, and a regular contributor on the Pb-Free Electronics Risk Management (PERM) Council. She is driving the industry toward incorporation of new technology requirements and provides technical input for document creation and research studies.
Matt Kelly is a senior technical staff member and senior inventor with IBM Systems, Canada. Kelly currently serves on seven technical committees at IPC. He is currently is vice chair of the 5-21H Bottom Termination Components Task Group and co-chair of the 2-17 Connected Factory Initiative Subcommittee.
Hans-Peter Tranitz is head of backend technologies at Continental Automotive, GmbH, in Germany. Dr. Tranitz co-created the IPC 5-21M Cold Joining Press-fit Task Group where he serves as co-chair.
MaryAlice Gill works in the Jabal Circuit’s Nypro Consumer Health division Clothing+ team. She is an active member of both the IPC D-70 E-Textiles Committee and IPC D-60 Printed Electronics Committee. She serves as vice-chair of the IPC Printed Electronics Terms and Definitions Task Group and co-chair of the D-71: E-Textiles Joining and Interconnection Techniques Subcommittee.
“IPC is fortunate to have MaryAlice, Milea, Hans-Peter and Matt sharing their skills and expertise with us,” said John Mitchell, IPC president and CEO. “Their input, knowledge and innovative approach is a benefit to IPC and to the industry at large.”
Share on:
Suggested Items
Compal Announces Completion of New Automotive Electronics Facility in Poland, Signaling Strategic Growth in Europe
06/30/2025 | Compal Electronics Inc.Compal Electronics is proud to announce the completion of Phase One of its new manufacturing facility in Czeladź, Silesian Voivodeship, Poland, marking a major milestone in its strategic expansion into the European automotive electronics market.
Leadership Development Continues at Incap Slovakia
06/30/2025 | IncapIncap Slovakia has launched the first leadership development training of 2025 as part of its ongoing Team Leaders Academy programme.
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
06/30/2025 | PRNewswireThe flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of 9.2% during the forecast period.
Incap Estonia Recognized with Second Golden Label for Responsible Business
06/27/2025 | IncapIncap Electronics Estonia has been awarded a golden label by the Responsible Business Forum in Estonia for the second time. The responsible business label is a prestigious symbol in Estonia that identifies entrepreneurs and organisations that demonstrate excellence in environmental, social, and economic responsibility.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.