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ZESTRON Academy Releases 2019 Cleaning Webinar Schedule
February 6, 2019 | ZESTRONEstimated reading time: Less than a minute
ZESTRON Academy has released the 2019 Cleaning Webinar Series schedule. ZESTRON Academy continues to educate production line operators, manufacturing and quality control managers as well as process engineers by providing detailed industry knowledge and troubleshooting techniques.
All webinars are FREE of charge, and will be presented by ZESTRON Academy’s accredited experts, Umut Tosun, M.S.Ch.E., Application Technology Manager, and Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer.
Featured topics:
- Should You Clean PCBs (March 21)
- DI-Water vs Chemistry (April 25)
- Cleaning with pH Neutral Chemistry – Background, Applications, and Benefits (May 23)
- Jet Printing Solder Paste and Cleaning Challenges (June 27)
- Defluxing Advanced Packages (July 25)
- Surface Cleanliness Assessment (August 29)
- Cleaning Before Conformal Coating (September 26)
- Multiple Thermal Cycle (October 24)
About ZESTRON
ZESTRON is headquartered in Manassas, Virginia and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.