Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
XLR8 Services Wins Top Honors for On-Time Delivery, Responsiveness, and Technology at IPC APEX EXPO 2019
February 8, 2019 | PRNewswireEstimated reading time: 1 minute
On January 29th at a ceremony at IPC APEX EXPO in San Diego, Circuits Assembly Magazine announced the winners of its 2019 Service Excellence Awards (SEAs) for electronics manufacturing services. They recognized companies that received the highest customer service ratings.
For companies with sales under $20 million, XLR8 SERVICES had the highest scores in three individual service categories with top honors for dependability/timely delivery, responsiveness, and technology.
XLR8 Services President, Jason Powell said, "I'm excited and humbled that we have been awarded top honors for a second year in a row. I am very proud of our team and their accomplishments in supporting a fast paced and dynamic customer base. We are honored to have received these awards. The team at XLR8 works very hard to be a leader within our market segment of supporting speed, technology, and rapid prototype services. These awards are a confirmation by our customers that we are hitting the mark and that we are a leader in the niche we support."
The awards represent back to back years of industry recognition where in 2018 XLR8 Services was presented awards at the IPC APEX show for Quality, Responsiveness, and Technology.
About XLR8 Services, Inc.
Based in San Clemente, CA, XLR8 Services is a rapidly growing contract manufacturer that focuses on supporting start-up companies, the engineering community, as well as larger OEM's with rapid prototype services and small volume production for their printed circuit assemblies with a core focus on speed and technology.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.