Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
Mentor Webinar: Correct Model Assignments for SI (Full Flow)
February 13, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Mentor, a Siemens business will hold a webinar on “Correct Model Assignments for SI (Full Flow)“ on February 21, 2019, 8:30 a.m. - 9:30 a.m. US/Pacific.
Signal Integrity simulation is only as good as your simulation models. This webinar will show best practices to assign models for your components in HyperLynx SI. Learn how to setup files to automatically map models to components brought into HyperLynx. Once your models are setup, simulation can be easy and accurate.
About the Presenter
Kyle Lake is an Applications Engineer for Oasis Sales. Before joining Oasis, Kyle was a Corporate Marketing Engineer at Mentor Graphics where he was responsible for helping customers identify solutions to their PCB design issues.
His primary focus at Oasis is supporting advanced solutions: PADS Professional, the Xpedition Enterprise Platform and PCB simulation tools for high-performance designs.
Share on:
Suggested Items
Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025
03/13/2025 | AismalibarAismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
03/13/2025 | TSMCMediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
VIA Announces Strategic Collaboration with Solectrix
03/13/2025 | VIA optronics AGVIA optronics AG, a leading supplier of interactive display solutions, today announced a new strategic collaboration with Solectrix GmbH, a full-service provider in the embedded electronics sector.
Teradyne to Acquire Quantifi Photonics
03/12/2025 | TeradyneTeradyne, Inc. announced it has entered into a definitive agreement to acquire privately held Quantifi Photonics, a leader in photonic IC testing.
indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
03/12/2025 | GlobalFoundriesindie Semiconductor, an automotive solutions innovator, has announced a strategic collaboration with GlobalFoundries (Nasdaq: GFS) (GF) to develop its portfolio of high-performance radar systems-on-chip (SoC).