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Betamek Achieves Top Level 5 in MaRii’s Supplier Competitiveness Assessment

01/21/2025 | Betamek
Betamek Berhad, an original design manufacturer (ODM) and a leading player in electronics manufacturing services (EMS) for the automotive industry, proudly announces that its wholly-owned subsidiary, Betamek Electronics (M) Sdn. Bhd. (Betamek Electronics), has achieved Level 5.

NovoLINC Secures Investments to Assist AI Computing with Groundbreaking Thermal Interface Technology

01/21/2025 | PRNewswire
NovoLINC, a thermal technology startup spun out of Carnegie Mellon University, announced seed funding led by M Ventures, with participation from Foothill Ventures and TDK Ventures. NovoLINC's breakthrough nanocomposite thermal solutions reduce thermal resistance to an industry-record low (< 1mm²-K/W), according to company co-founders, CSO Prof. Sheng Shen and CTO Dr. Rui Cheng.

U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera

01/21/2025 | U.S. Department of Commerce
The U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.

The Pulse: Ultra Upgrade Unknowns—What’s Coming for UHDI?

01/21/2025 | Martyn Gaudion -- Column: The Pulse
As we enter the second quarter of the 21st century, there appears to be a new chapter in PCB technology. Ultra high density interconnect (UHDI) has become a buzzword, but it’s actually not that new; many of the processes were already established in the high-volume production of Asian cell phones and tablets. What is new and challenging, however, is migrating the line widths and stackups—once the domain of handheld consumer products—into the lower volume specialized environment of the commercial world.
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