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I-Connect007 Editor's Choice: Five Must-Reads for the Week
January 17, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Ah, January! The season of new beginnings, new goals, and the annual company meeting, where all the initiatives and objectives that survived the end-of-year planning and budgeting process are launched. Such as the case for our IPC team this week as we gathered in Chicago for some games, some inspiration, and, most definitely, some goal setting.
We’re even more committed to being your best source for industry news and tips and tricks of the trade. To that end, I’m sharing my favorite news items of the week. They range from reports on quarterly earnings to Dan Feinberg’s coverage of CES and some harsh reality from marketing expert Dan Beaulieu. If you missed it on Monday, be sure to read it again here. It’s well worth your time.
Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024
January 15
System design continues to move to the forefront of all the design methodologies. No longer can we design in “silos of discipline,” but human collaboration and design data sharing continue to integrate. The ESD Alliance, a SEMI Technology Community tracking this space, announced in its latest Electronic Design Market Data (EDMD) report that, among the data included, the four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.7%. This is a good read for those who follow the design tools market.
Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
January 14
Dan Feinberg, our resident expert on CES, reports in with his review of the show’s most significant announcements. In these announcements, the industry’s biggest players showcase their key strategic objectives for 2025, inevitably with a trickle-down effect on PCB manufacturing. Dan’s coverage of CES is not to be missed.
Global PCB Connections: The Future of HDI PCBs
January 16
In this column this month, Jerome Larez takes a long look at high density interconnect (HDI). While HDI techniques have been available for quite some time, HDI is steadily moving down the adoption curve from “bleeding edge” to “early and late majority” status. HDI is increasingly a requirement for our customers. Whatever your role in electronics manufacturing, you can benefit from understanding what HDI entails. Give Jerome’s column a read; he does a good job making it clear.
TI Launches New Edge AI-enabled Radar Sensor and Automotive Audio Processors
January 10
Responding to the combination of factors of increased vehicle safety and more immersive rider experiences, Texas Instruments have developed a new line of sensors and electronics components for the automotive market. As stated in the press release, the demand for added capability and value is up and down the vehicle portfolio, from luxury to economy models. Read more here.
It’s Only Common Sense It’s Not the Market’s Fault—Take Responsibility for Your Business
January 13
Long-time columnist Dan Beaulieu pulls no punches in this column, launching with this: “Stop blaming the market and start looking in the mirror. Success doesn’t happen by chance; failure isn’t simply bad luck. It’s about owning your decisions, adapting to change, and focusing on what you can control. If you want to survive and thrive, it’s time to take responsibility for your business.”
Now that we’ve all had our planning sessions and our annual kickoff meetings, check your progress against the points Dan makes in his column.
Suggested Items
Qorix, Qualcomm Cooperate to Drive the Future of Software-Defined Vehicles
02/07/2025 | Qualcomm Technologies, Inc.Qorix, a global provider of modular and integrated automotive middleware solutions, and Qualcomm Technologies, Inc., a leader in automotive platforms, announced a technology cooperation to help drive the future of software-defined vehicles (SDVs) with high performance, pre-integrated and scalable solutions designed to enable OEMs and tier-1 suppliers to develop next generation vehicles quickly and efficiently.
Dan Beeker on the Design Engineer of the Future
02/07/2025 | Andy Shaughnessy, Design007 MagazineAs technical director at NXP Semiconductors, Dan Beeker specializes in EMC and signal integrity design techniques. He’s known for his field-based design classes; you may remember the cover of Meghan Trainor’s “All About That Bass” that Dan and his daughter Breezy released in 2015 titled “All About The Space.” Check it out on YouTube; it’s funny, and it definitely gets the point across. As we begin 2025, I contacted Dan to get his thoughts about the design engineers of the future. What will their jobs look like?
SFL Missions Awarded Canadian Space Agency Contract for HAWC Satellite Mission Conceptual Design Study
02/07/2025 | BUSINESS WIRESFL Missions Inc. has been awarded a competitive bid contract by the Canadian Space Agency (CSA) to conduct a conceptual design study of the planned High-Altitude Aerosols, Water vapour, and Clouds (HAWC) satellite mission. HAWC is Canada’s contribution to NASA’s Atmosphere Observing System (AOS) mission slated for launch in 2031.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
02/07/2025 | Marcy LaRont, I-Connect007For my top picks this week, I wanted to highlight some other important content we’ve featured. First is the incomparable Stephen Chavez, who provides insight into what the future PCB designer will look like. Bob Duke of American Standard outlines the seven key challenges he sees in offshore manufacturing. We move seamlessly from there to tariffs, one of today’s most talked about topics. Jeffrey Beauchamp of NCAB looks back at a recent timeline regarding tariffs, and it’s quite interesting. I’m also pointing you toward a feature on a thriving EMS company in Malaysia, one of the two most popular locations for China Plus One manufacturing expansions. Finally, we acknowledge the expansion news of a long-time PCB and EMS global supplier.
First Pan-European Electronics Design Conference (PEDC) in Vienna Inspires Participants from 20 Countries
02/06/2025 | IPCThe first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents.