IPC Issues Call for Participation for IPC APEX EXPO 2020

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IPC — Association Connecting Electronics Industries invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2020 to be held at the San Diego Convention Center. Professional development courses will take place February 2, 3 and 6, 2020 and the technical conference will take place February 4–6, 2020.

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium Corporation, MacDermid Enthone, Northrop Grumman, Oracle and Robert Bosch GmbH have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

• 3D Printing in Electronics Manufacturing
• Automation in Electronics Manufacturing
• Adhesives
• Advanced Technology
• Area Array/Flip Chip/0201 Metric
• Assembly and Rework Processes
• BGA/CSP Packaging
• Black Pad and Other Board Related Defect Issues
• BTC/QFN/LGA Components
• Business & Supply Chain Issues
• Cleaning
• Conformal Coatings
• Corrosion
• Counterfeit Electronics
• Design
• Electromigration
• Electronics Manufacturing Services
• Embedded Passive & Active Devices
• Environmental Compliance
• Graphene in Electronics Manufacturing
• Lean Six Sigma
• LED Manufacturing
• Failure Analysis
• Flexible Circuitry
• HDI Technologies
• Head-on-Pillow
• Board and Component Warpage
• High Speed, High Frequency & Signal
• Industry 4.0
• Integrity
• Lead-Free Fabrication, Assembly & Reliability
• Miniaturization Nanotechnology Optoelectronics
• Packaging & Components
• PCB Fabrication
• PCB and Component Storage & Handling Performance
• Quality & Reliability
• Photovoltaics
• PoP (Package-on-Package)
• Printed Electronics
• Reshoring
• RFID Circuitry
• Robotics
• Soldering
• Surface Finishes
• Test, Inspection & AOI
• Tin Whiskers
• 2.5-D/3-D Component Packaging
• Underfills
•  Via Plugging & Other Protection
• Wearables

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.

Technical conference paper abstracts are due June 21, 2019 and course proposals are due June 24, 2019. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP. For more information on technical conference or professional development course participation, contact Brook Sandy-Smith, IPC technical education program manager at BrookSandy@ipc.org.

About IPC

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.