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RTW IPC APEX EXPO 2019: Lenthor Discusses Facility Expansion and New Equipment
February 20, 2019 | Real Time with...IPCEstimated reading time: Less than a minute

Rich Clemente, general manager of Lenthor Engineering, discusses with Dan Feinberg, I-Connect007 Guest Editor, the company’s expansion and new facility and equipment. He also talks about his outlook for the electronics manufacturing industry in North America.
To watch the interview, click here.
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Simon Khesin - Schmoll MaschinenSuggested Items
Our Legislative Outlook: PCB007 Magazine October 2025 Issue
10/16/2025 | I-Connect007 Editorial TeamMost agree that we are experiencing an unprecedented time in global business and economics, with rules and laws that open doors to business but can complicate operations and make profitability more challenging. This month, PCB007 Magazine features some of today’s leading experts on legislative issues affecting the electronics industry, including rules and laws, trade, sustainability, business expansion, grants, and more in the U.S., Europe, and China.
Foxconn's Rotating CEO, Yang Qiujin, Named One of Asia's Most Influential Women
10/15/2025 | Foxconn ElectronicsHon Hai Precision Industry Co., Ltd.'s management team has once again received recognition! Rotating CEO Kathy Yang has been named to Fortune magazine's " Most Powerful Women Asia 2025 " list of the 100 most influential women in Asia , achieving a remarkable fifth place in her debut.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.