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Tips & Tricks Webinar for Successfully Cleaning Circuit Assemblies
February 26, 2019 | Aqueous TechnologiesEstimated reading time: 1 minute
In the last half of the 20th century, cleaning of circuit assemblies was a standard assembly practice. The abolishment of popular CFC-based cleaning solvents ushered the introduction of “no-clean” assembly processes. For much of the electronic assembly industry, cleaning became nonexistent.
Due to assembly and component miniaturization and the explosion of both Internet of Things (IoT) and automotive electronics, which places many circuit assemblies into harsh environments, the practice of removing harmful ionic contamination from circuit assemblies has once again become a mainstream practice. Today, the majority of electronic assemblies are cleaned. And, for many assemblers, cleaning is a new process.
In line with this, Aqueous Technologies will be holding a live webinar on March 12 to present modern best-practice cleaning techniques, including the following:
- An historical look back at cleaning
- The reason for cleaning
- Reasons for cleaning no-clean flux residues
- Conventional cleaning technologies
- Estimating throughput capabilities on batch and inline cleaning systems
- Do's and don'ts of cleaning circuit assemblies
- How to choose a cleaning chemical (if needed)
- How to determine the assemblies are clean during the cleaning process
- How to determine the assemblies are clean after the cleaning process
- New IPC Cleanliness assessment standards
- Environmental mitigation techniques
- Calculating the per-assembly cost of cleaning
- Keeping your cleaning machine in top-working order
For more information or to register, click here.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at productronica
10/21/2025 | ITWITW EAE will be showcasing its latest developments at productronica, November 18-21 in Munich, Germany. The ITW EAE booth A4–554 will have MPM, Camalot, Electrovert, Vitronics Soltec and Despatch applications experts on hand as well as sales and management to answer questions and offer solutions.
FCT Leverages Flex Design and Total Build Solutions to Drive Innovation
10/22/2025 | Marcy LaRont, PCB007 MagazineWhat’s hot in flexible circuits right now? At PCB West, I spoke with Ben Savage, business development manager at Flexible Circuit Technologies (FCT), about their flex design services and end-markets where FCT sees the most flex activity. We also discussed the company’s focus on providing supply chain resiliency, as well as the constant search for new flex engineers. If you’re looking for a new opportunity in flexible circuits, FCT is hiring.
PCBA Market Poised to Reach $147.5 Billion by 2035
10/20/2025 | Globe NewswireGlobal printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035
Precision PCB Acquires Assets of Microplace
10/13/2025 | Precision Technologies Inc.Precision Technologies Inc., doing business as Precision PCB, a One-Stop PCB Fabrication and Assembly services company with 27 years of experience providing Quality, Reliability and Excellence in customer service, has acquired the assets of Microplace, Inc.