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RTW IPC APEX EXPO 2019: Advanced 3D Solder Paste Inspection Technology
February 27, 2019 | Real Time with...IPCEstimated reading time: Less than a minute

Olivier Pirou, managing director of Vi TECHNOLOGY, provides I-Connect007 Guest Editor Joe Fjelstad with an overview of the company's advanced 3D inspection technology for solder paste including the ability to make corrections in real time.
In this interview, Pirou also discusses his company's efforts in strengthening their inspection systems, particularly for the high-reliability application segments.
Click here to watch this interview.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
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09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
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