Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
RTW IPC APEX EXPO 2019: Advanced 3D Solder Paste Inspection Technology
February 27, 2019 | Real Time with...IPCEstimated reading time: Less than a minute
Olivier Pirou, managing director of Vi TECHNOLOGY, provides I-Connect007 Guest Editor Joe Fjelstad with an overview of the company's advanced 3D inspection technology for solder paste including the ability to make corrections in real time.
In this interview, Pirou also discusses his company's efforts in strengthening their inspection systems, particularly for the high-reliability application segments.
Click here to watch this interview.
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