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Indium Launches Die-Level Bonding Solder Composite
February 28, 2019 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation has launched InFORMS ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.
Indium Corporation’s InFORMS ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance.
Until recently, InFORMS technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS include:
- Drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
- Available in ribbon and preforms
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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