Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
Target Condition: Floor Planning Without a Floor
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
Zuken Launches 3D Harness Design Solution
March 1, 2019 | ZukenEstimated reading time: 2 minutes
Zuken introduces E3.WiringSystemLab, a new software solution that enables the optimization of complex wire harness designs based on inputs from heterogeneous sources. The product can import connectivity information from a broad range of sources and consolidates them with 3D topology data. The resulting 3D topology can be evaluated and optimized in a consistent 3D environment that has been designed to support the needs of casual users without requiring specialized training. Specialized functionality tailored specifically to topology exploration provides the ability to create and evaluate different architectural concepts.
Connectivity data can be imported from E3.cable, as well as via industry standard formats such as KBL, VEC, PLMXML, or even generic Excel® files. Topology information is imported in the form of geometrical bundles defined in the MCAD systems like CATIA, NX or Creo. Based on these inputs, E³.WiringSystemLab provides the ability to host the complete wire harness optimization process within in a consistent 3D environment. Comprehensive modifications can be applied to the imported harness, including changes of packaging, partitioning into sub-harnesses and insertion of new routing pathways.
“Optimizing wire harness designs to meet targeted weight and cost objectives is a complex and challenging task”, comments Reinhold Blank, Zuken Business Director for Automotive & Transportation. “In particular, the preparation of data that typically involves a laborious flattening to 2D has been a huge time sink for the industry. With E3.WiringSystemLab we are providing a solution that revolutionizes the import and consolidation of data sources from different origins and supports wiring system experts to optimize their complex designs in a modern 3D environment.“
With its generic cost and weight evaluation and exploration capabilities, Zuken’s E3.WiringSystemLab achieves a substantial reduction of ramp-up and optimization cycles for wiring harness engineers.
Zuken’s new harness topology optimization E3.WiringSystemLab will be presented at the following events:
USA: Zuken Innovation World Americas
Hilton Head, SC, April 15 – 17, 2019
Europe: Automotive Wire Harness Conference
Ludwigsburg, Germany, March 26–27
E3.WiringSystemLab provides optimization capabilities of imported wire harness designs: add/delete bundles and route pathways (1), change position of components, splices and ground bolts (2), modify partitioning of harnesses (3)
With easy-to-use cost and weight evaluation and modification capabilities, Zuken’s E3.WiringSystemLab enables a substantial reduction of ramp-up and optimization cycles for wiring harness engineers.
About Zuken
Zuken is a global provider of leading-edge software and consulting services for electrical and electronic design and manufacturing. Founded in 1976, Zuken has the longest track record of technological innovation and financial stability in the electronic design automation (EDA) software industry. The company’s extensive experience, technological expertise and agility, combine to create world-class software solutions. Zuken’s transparent working practices and integrity in all aspects of business produce long-lasting and successful customer partnerships that make Zuken a reliable long-term business partner. Zuken is focused on being a long-term innovation and growth partner. The security of choosing Zuken is further reinforced by the company’s people—the foundation of Zuken’s success. Coming from a wide range of industry sectors, specializing in many different disciplines and advanced technologies, Zuken’s people relate to and understand each company’s unique requirements.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Wisdom From Data-center Power Pioneer Mike Mosman
09/02/2025 | Barry Matties, I-Connect007Few engineers have moved the levers of modern electronics more decisively than Mike Mosman. From the pre-email computer rooms of the 1980s to today’s hyperscale campuses cranking out AI cycles, the retired power engineer and co-founder of CCG Facilities Integration has spent four decades proving that uptime is a design discipline, not a hope.
HPE Accelerates Self-driving Network Operations with New Mist Agentic AI-native Innovations
08/26/2025 | BUSINESS WIREHPE announced major innovations to its HPE Juniper Networking portfolio, advancing its AI-native Mist platform to deliver agentic AIOps through more autonomous, intelligent and proactive network operations.
Macronix Introduces Cutting-Edge Secure-Boot NOR Flash Memory
08/08/2025 | PRNewswireMacronix International Co., Ltd., a leading integrated device manufacturer in the non-volatile memory (NVM) market, announced ArmorBoot MX76, a robust NOR flash memory combining in a single device, the essential performance and an array of security features that deliver rapid boot times and iron-clad data protection.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.
AI Is the Golden Track Reviving Electronics and PCBs
08/06/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial TeamRemember 2021? Despite COVID, the electronics industry hit a high. Then came the slide. By 2023, the industry was deep in the red. With inflation, policy shifts, and exchange rate shocks, the problems were long, and the outlook was bleak. Recovery finally appeared in 2024, but it was fragile. Automotive electronics slumped, wireless demand stayed soft, and the ride up was anything but smooth. Yet, amid the uncertainty, one bright track emerged: artificial intelligence (AI).