Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
MacDermid Alpha to Exhibit at SMTA Dallas Expo & Tech Forum
March 5, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The Assembly division of MacDermid Alpha Electronics Solutions will be exhibiting at the Dallas Expo & Tech Forum taking place at the Plano Event Center in Texas on Tuesday, March 19, 2019. MacDermid Alpha will be featuring its low temperature solder technologies and reclaim and sustainability programs.
MacDermid Alpha will be promoting its recently launched ALPHA OM-358 ultra-low voiding solder paste. ALPHA OM-358 is a lead-free, zero-halogen solder paste designed to provide best-in-class voiding performance on all component types, including bottom terminated components. “This paste provides excellent resistance to electrochemical migration on fine pitch components.“, said Robert Wallace, Regional Marketing Manager for the Americas. “This makes OM-358 ideal for high-reliability applications, especially automotive in-cabin electronics, sensors, and powertrain“.
In addition, MacDermid Alpha will feature its Metals Reclaim and Sustainability programs. With over thirty years experience, MacDermid Alpha is North America’s largest solder manufacturer and recycler of electronics manufacturing waste. Its proprietary refining system upgrades the recycled material into better than vigin metal, enabling MacDermid Alpha to provide its customers with products using 100% recycled tin. “We are committed to creating a more sustainable supply chain.“, said Mitch Holtzer, Director of the Americas Reclaim Business. “We work closely with our customers to support their environmental initiatives for recycled products and managing their waste streams.“
About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
About MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions is a Platform Specialty Products business. Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.