Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
AIM to Participate at productronica China 2019
March 7, 2019 | AIM SolderEstimated reading time: 1 minute
AIM Solder has announced their participation at productronica China, scheduled to take place March 20-22, 2019 at Shanghai New International Expo Centre in Shanghai, China. AIM Solder will highlight its REL electronic solders and its new RX18 and CX18 cored solder wire.
REL22TM is an award-winning, high reliability alloy developed to address reliability and production quality issues common to similar multi-element alloys. Both internal and customer testing has proven that REL22 improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting. REL61TM is ideally suited for industries which require a cost effective alternative to SAC305 with no loss of processing performance or durability. REL61 provides significant advantages over other no-low silver alloys by offering better flow characteristics at lower temperatures, thus reducing PCB damage and assembly costs.
AIM will also feature its new cored wire solders, RX18 and CX18. The award-winning RX18 is engineered for automated soldering and promotes thermal transfer, fast wetting and reduces voids/skips. With an operator friendly, low odor/smoke formula, CX18 extends the solder tip life and leaves clear, minimal residues.
AIM will highlight its full line of advanced solder materials, including its solder paste, liquid flux in addition to their exciting new high reliability alloys. To discover all of AIM’s products and services, visit the company at productronica China at the Shanghai New International Expo Centre in booth E2.2760 and speak with one of AIM’s knowledgeable staff members.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.