Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
Connect the Dots: The Future of Designing for Reality—Pattern Plating
Beyond the Board: The Benefits of Early PCB Engagement in Aerospace and Defense Programs
EMA Webinar: How to Design with Supply Chain in Mind
March 7, 2019 | EMA Design AutomationEstimated reading time: Less than a minute
BOM denied: Redesign required. These are four words any engineering team dreads. You spent countless hours designing, crafting, and testing your product to perfection only to have everything put in jeopardy due to component sourcing issues.
Obsolete parts, RoHS / REACH compliance issues, inadequate stock—almost every engineer has been bitten by one of these issues at some point. What's worse is these issues often result in some sort of late-stage redesign. Fortunately, it doesn’t have to be this way.
On March 14 at 2 pm Eastern Time, join EMA Design Automation and SiliconExpert for a free webinar that focuses on the common causes of BOM rejection and how to prevent these issues in the future.
What attendees will learn:
- Common reasons for your design and BOM to be rejected
- The impact of these issues (on engineering and the overall chance of your products success)
- How to avoid spec’ing in unorderable / obsolete / non-compliant parts at the design stage
- How to generate supply chain ready ‘Zero-Touch’ BOMs as an inherent part of your design process
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias
02/13/2026 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading U.S. manufacturer of advanced printed circuit board solutions, has successfully manufactured and shipped multiple IC substrate designs incorporating 5 to 7 stacked microvias using the company’s advanced Ultra High Density Interconnect (UHDI) manufacturing platform.
Astera Labs Opens Israel Design Center to Boost AI Connectivity Expansion
02/13/2026 | Astera Labs, Inc.Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/13/2026 | Michelle Te, I-Connect007This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.
Proper Plane Design Techniques
02/12/2026 | I-Connect007 Editorial TeamContinuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use. When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical.