Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
SemiGen Releases New Blog on Lange Couplers
March 8, 2019 | SemiGenEstimated reading time: Less than a minute
SemiGen, Inc., an ISO and ITAR registered provider of RF and microwave contract assembly, foundry services, semiconductor devices, and RF supplies, has released a new blog detailing the development of the Lange Coupler by Dr. Julius Lange of Texas Instruments in 1969, while his group was engineering microwave amplifiers on thin film ceramic substrates. The team employed a Bell Labs approach that used 3 dB quadrature couplers, but initially struggled to find the ideal combination of low loss and wide bandwidth.
Coupled line connectors could not achieve coupling factors of 3 or 6 dB, as they were too loose. Conversely, the transistors between the interdigitated base and emitter fingers were packed too tightly. Through necessity, invention arose: Lange recalled that geometric symmetry could guarantee the 90° split between outputs known as quadrature. By only moving a portion of the crossovers to the middle, he achieved the desired loss and bandwidth targets.
Share on:
Suggested Items
Insulectro Technology Village to Feature 35 Powerchats at IPC APEX EXPO 2025
03/11/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, will present its popular and successful 13.5-minute PowerChats™ during this year’s IPC APEX EXPO at the Anaheim Convention Center, March 18-20, 2025.
Drip by Drip: Semiconductor Water Management Innovations
03/05/2025 | IDTechExNot only does semiconductor manufacturing require large volumes of energy, chemicals, and silicon wafers, it also requires vast volumes of water. IDTechEx’s latest report, “Sustainable Electronics and Semiconductor Manufacturing 2025-2035: Players, Markets, Forecasts”, forecasts water usage across semiconductor manufacturing to double by 2035, as demand for integrated circuits continues to rise.
Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces
02/28/2025 | PRNewswireNeural interfaces are crucial in restoring and enhancing impaired neural functions, but current technologies struggle to achieve close contact with soft and curved neural tissues. Researchers at Pusan National University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures.
The Chemical Connection: Earthquakes, Astronauts, and Aquatics—A Lighter Look at the Past
02/25/2025 | Don Ball -- Column: The Chemical ConnectionIPC will host its 25th IPC APEX EXPO with the theme “Reimage the Possibilities,” in Anaheim, California, next month. It will also mark the 68th anniversary of IPC’s founding. This year’s event brings up many memories of IPC APEX EXPO’s past and former National Electronics Packaging Conferences (NEPCONs). In this column, I would like to share some of the lighter moments from my almost 50 years of exposition experiences—especially those in Anaheim.
EIPC 2025 Winter Conference: Business Outlook and New EMS Opportunities
02/18/2025 | Pete Starkey, I-Connect007“Navigating and Optimizing Complex Processes: How to Overcome Today’s and Tomorrow’s Challenges in PCB Processing” was the theme of the 2025 EIPC Winter Conference, held Feb. 4–5, in historic Luxembourg City, the capital of Luxembourg, a small country in the heart of western Europe with borders to Belgium, France, and Germany. EIPC president Alun Morgan welcomed delegates from more than 70 companies in Europe and beyond, and thanked the sponsors of the event. Morgan can always be relied upon for a topical opening presentation. This time, he addressed “Internet of Things: Vulnerabilities and How to Address Them.”