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Indium to Explore the Critical Materials and Packaging Process Connection at CPRIM 2026

09/01/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and reliability at the Conference on Advanced Packaging Reliability Technology and Interconnect Materials (CPRIM) 2026, September 4, in Guangzhou, China.

Trouble in Your Tank: Pre-electroless Causes of Voids

09/02/2026 | Michael Carano -- Column: Trouble in Your Tank
To support advanced 2.5D and 3D heterogeneous integration, product and motherboard designs are now using higher layer counts. As layer counts increase, plated through-holes (PTHs) become deeper and higher in aspect ratio, making it more difficult to achieve a continuous, void-free copper deposit. Drilling these thicker panels and higher aspect ratio vias adds another layer of complexity. Since there are many potential causes of PTH voiding, I’ll focus on pre-electroless copper causes, including drilling.

Flexible Thinking: Beyond DFM—PCB Design and Manufacturing as a Cooperative Effort

09/01/2026 | Joe Fjelstad -- Column: Flexible Thinking
The concept of co-designing PCBs by incorporating input from all areas of manufacturing has grown significantly over the past several years, bringing a sharper focus on the early contributors to a collaborative electronic system. From those pioneers, we have learned that the PCB is no longer simply the platform on which a design is manifested; it is now an active part of the electrical, thermal, mechanical, and economic architecture of the product. As operating frequencies rise, component pitches shrink, power densities increase, and product schedules tighten, decisions made by one discipline can no longer be isolated from the consequences they create for others.

BTU International Launches Aurora Vacuum Reflow Oven for High-Volume Manufacturing

08/26/2026 | BTU International, Inc.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the launch of the Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow platform engineered to deliver exceptional solder quality, maximum throughput, and higher manufacturing yields for advanced electronic assemblies.

Genie Space Edge Processor Achieves Space Heritage with Successful U.S. Space Force Mission

08/26/2026 | PRNewswire
Ibeos, a Trident Systems company, announced that its Genie Space Edge Processor has successfully achieved space heritage following its operation during U.S. Space Force Victus Haze mission performing flawlessly.
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